固溶处理冷却方式对Cu/Al复合板界面微观组织的影响

doi:10.11896/cldb.19120157

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Abstract The effect of cooling mode (water cooling, air cooling, furnace cooling) on the interface microstructure of Cu/Al clad sheet was studied by means of optical microscopy, scanning electron microscopy and X-ray diffraction. And the effect of cooling mode on the mechanical properties of cast rolled Cu/Al clad sheet was tested by microhardness testers. The experimental results indicate that five kinds of intermetallic compounds, i. e. Al₂Cu, AlCu, Al₂Cu₃, Al₄Cu₉, AlCu₃ were formed at the interface layer after solution treatment at 500 ℃×2 h. There can be found holes in the diffusion layers after water cooling and air cooling, but nearly no holes on the interface after furnace cooling. The reason of holes forming and the change process of holes were studied. The defects such as holes will weaken the bonding strength of interface layer. The interfacial diffusion layer of the as-cast and rolled sheet is thin and the hardness is low. After solution treatment the thickness and hardness will be increased, and a lower cooling rate can result in a thicker and harder diffusion layer. During the stripping process, the cast and rolled sheet fractured near the Al matrix, and the solution-treated sheet fractured at the interface diffusion layer. With the decrease of the cooling rate, the crack propagation ability gets weaken, which indicates that excessively thick intermetallic compounds are not conducive to the combination of the clad sheet.

Key words： Cu/Al clad sheet solution treatment interface diffusion intermetallic compound air cooling furnace cooling water cooling

Published: 26 April 2020

Fund:This work was financially supported by the National Natural Science Foundation of China (51971183), the Natural Science Foundation of Chongqing (cstc2019jcyj-msxmX0594), Technology Innovation and Application Development Project of Chongqing (cstc2019jscx-mbdxX0036).

Corresponding Authors: Xianquan Jiangis a second-level professor and docto-ral supervisor in the school of Materials and Energy, Southwest University. He received his Master's degree from the Central South University of Technology, 1992, and Ph.D. from Sichuan University, 2006. He has published 75 papers on Electrochimica Acta, Journal of Alloys and Compounds, Materials and Design, Materials Science & Engineering, etc., in which 51 were indexed by SCI and EI.

About author:: Yujie Liu is a graduate student in the school of Mate-rials and Energy, Southwest University. Under the gui-dance of Professor Xianquan Jiang, her main research field is interface of Cu-Al composite materials.

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	LIU Yujie
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Cite this article:

LIU Yujie,JIANG Xianquan,SHE Xinwei, et al. Effect of Cooling Method on Interface Microstructure of Cu/Al Clad Sheet by Solution Treatment[J]. Materials Reports, 2020, 34(10): 10132-10137.

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http://www.mater-rep.com/EN/10.11896/cldb.19120157 OR http://www.mater-rep.com/EN/Y2020/V34/I10/10132

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