铜/铝双金属复合材料研究新进展

doi:10.11896/cldb.19050192

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Abstract Bimetallic composite is a hotspot in material research because it integrates the excellent properties of various matrix metals and makes up for the deficiency of single metal. As a typical bimetallic composite, Cu/Al bimetallic composite comprehensively utilizes the advantages of high conductivity and heat conduction of copper, as well as light weight, easy welding and low cost of aluminum, which is widely used in electric po-wer, heat transmission, automobile and other fields, attracting extensive attentions of researchers at home and abroad.
However, the main difficulties in preparing Cu/Al bimetallic composites include: (1) both copper and aluminum materials are easy to be oxidized, and the formed oxidation film is difficult to be removed; (2) the interface is easy to form hard and brittle intermetallic compounds, which will harm the performance of Cu/Al bimetallic composites. Therefore, in recent years, researchers have made a lot of researches including how to improve the existing processes and develop new processes; exploring the interface formation mechanism, growth regulation of intermetallic compounds, size and performance matching between component metals, deformation and heat treatment coordination, performance characte-rization and other aspects.
The growth of intermetallic compounds is controlled by optimizing process parameters and physical and chemical methods to improve interfacial bonding strength. In-situ characterization is used to observe the phase evolution of the interface and explore the interface bonding mechanism. Combined with the finite element simulation technology, the research on deformation, heat treatment and defect prediction of Cu/Al bimetallic composite is carried out to guide the actual production. The mechanical, electrical, thermal and corrosion resistance properties of Cu/Al bimetallic composites are evaluated comprehensively, and their application potential is explored continuously.
In this paper, the preparation process of Cu/Al bimetal is summarized, and the application of combined bonding process is highly reviewed. The research progress of Cu/Al bimetallic composites in the interfacial composition, evolution of interface phase observed by in-situ equipment, evaluation of interface performance and improvement of interfacial bonding performance are reviewed, and the future research direction of Cu/Al bimetallic composites is forecasted.

Key words： copper/aluminum clad interface intermetallic compounds thermal properties bonding strength

Published: 10 April 2020

CLC number:

TB331

Fund:This work was financially supported by the National Natural Science Foundation of China (51674166).

About author:: Guoping Liu, Ph. D. student in Shanghai Jiao Tong University, research on laminated metal composites.
Qudong Wang, professor, doctoral supervisor. Now in National Engineering Research Center of Light Alloy Net Forming, Shanghai Jiao Tong University. His research direction include: light alloy and its forming technology, new technology of material preparation and forming, metal matrix composites.

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	JIANG Haiyan

Cite this article:

LIU Guoping,WANG Qudong,JIANG Haiyan. New Research Progress on Copper/Aluminum Bimetallic Composites[J]. Materials Reports, 2020, 34(7): 7115-7122.

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http://www.mater-rep.com/EN/10.11896/cldb.19050192 OR http://www.mater-rep.com/EN/Y2020/V34/I7/7115

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