SnBiAg无铅钎料恒温激光焊接的数值模拟与实验研究

doi:10.11896/cldb.24010216

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Abstract This work investigates the thermostatic welding process of SnBiAg lead-free solder through establishing a three-dimensional transient numerical model by employing the finite element method, considering the influence of the choice of heat source, and reveals the relationship between laser process parameters and microstructure. The numerical simulation results demonstrate that a heat source with a rectangular-truncated-pyramid-like distribution is suitable for thermostatic laser welding processes. Under different parameters, significant temperature variations are observed in solder joints at different positions. The experimental results indicate that the welding temperature and time have a substantial influence on the microstructure of the solder. The phase distribution in the solder may be made more uniform by appropriately increasing the welding temperature and extending the welding time. The optimal process parameters for the thermostatic laser welding of SnBiAg are determined as a wel-ding temperature of 210 ℃ and a welding time of 15 s.

Key words： finite element analysis thermal-distribution simulation laser welding SnBiAg solder microstructure

Published: 10 February 2025 Online: 2025-02-05

CLC number:

TG425

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	FENG Chao
	YANG Zifan
	LIU Yueli

Cite this article:

FENG Chao,YANG Zifan,LIU Yueli. A Numerical and Experimental Study of the Thermostatic Laser Welding Process of SnBiAg Lead-free Solder[J]. Materials Reports, 2025, 39(3): 24010216-6.

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http://www.mater-rep.com/EN/10.11896/cldb.24010216 OR http://www.mater-rep.com/EN/Y2025/V39/I3/24010216

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