Materials Reports  2024, Vol. 38 Issue (13): 22100128-7     https://doi.org/10.11896/cldb.22100128
METALS AND METAL MATRIX COMPOSITES |
Study on Vacuum Diffusion Bonding Tungsten with Copper Interlayer
LIAO Lu1, ZHANG Yongbin1, LI Peng2,*
1 Institute of Machinery Manufacturing Technology, China Academy of Engineering Physics, Mianyang 621900, Sichuan, China
2 School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, Liaoning, China