Materials Reports  2021, Vol. 35 Issue (z2): 589-592 |
| POLYMERS AND POLYMER MATRIX COMPOSITES |
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| Application of Phenolic-formaldehyde Resin on CCL |
| FAN Cuihong, QIN Huibin, ZHOU Jijun
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| Institute of Electron Device & Application, Hangzhou Dianzi University, Hangzhou 310018, China |
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Abstract High Temperature CCL was prepared by using high temperature's curing agent. According to the four factors of epoxy, phenoxy, phenolic- formaldehyde and the content of filler, different levels of orthogonal test were designed. Through range analysis and variance analysis, it was determined that the content of filler was an important factor of thermal conductivity of insulation layer, followed by phenolic-formaldehyde.The lower the content of phenolic-formaldehyde, the higher the thermal conductivity, and the highest was 1.99 W/(m·K), and the fusion point of Tg could reach 299.53 ℃.
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Published: 09 December 2021
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| Fund:This work was financially supported by the Science and Technology Projects of Zhejiang Province (2017C01027). |
About author:: Cuihong Fan is a graduate student in Hangzhou University of Electronic Science and Technology, her research focus on the circuit and system.
Huibin Qin is a professor, postgraduate supervisor and doctoral supervisor at Hangzhou University of Electronic Science and Technology, his research interests focus on the analysis, design and development of electronic information materials and electronic information devices, in addition, including intelligent and integrated sensing technology. |
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