键合丝键合界面研究进展

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Abstract When the integrated circuit is packaged by wire bonding technology, the bonding wire and the Al pad have a heterointerface problem, which has a great influence on the performance of the electronic device. In this paper, the research progress of bonding parameters, interfacial intermetallic compound (IMC) evolution behavior and working environment on interface bonding strength and reliability is reviewed, and the deve-lopment of bonding interface research methods are prospected.

Key words： bonding wire interface intermetallic compound (IMC) bonding strength reliability

Published: 25 November 2019

CLC number:

TG146

Fund:This work was financially supported by the National Key Research and Development Program of China (2016YFB0402602).

About author:: Cheng Peng received his B.E. degree in Materials Science and Engineering from Chongqing University of Technology in 2017. He is currently pursuing his M.S. at the College of Material Science and Engineering, Chongqing University of Technology under the supervision of Prof. Fuxiang Huang. His research has focused on theoretical study of functional materials.
Fuxiang Huang received his B.E. degree in Materials Science and Engineering from Chongqing University in 1985 and received his Ph.D. degree in hylology from the Tsinghua University in 2003. He is currently a full professor in Chongqing University of Technology. In recent years, his research interests are metal functional mate-rials, computational materials science, material surface and interface analysis, etc. More than 120 papers have been published in important domestic and international publications such as Scripta Materialia, and those have been cited more than 200 times by others.

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	PENG Cheng
	LIANG Shuang
	HUANG Fuxiang
	ZHONG Mingjun
	RAN Xiaojie

Cite this article:

PENG Cheng,LIANG Shuang,HUANG Fuxiang, et al. Research Progress on Bonding Interface of Bonded Wire[J]. Materials Reports, 2019, 33(Z2): 501-504.

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http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2019/V33/IZ2/501

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