环氧导电胶的反应动力学及其应用

doi:10.11896/cldb.22020025

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Abstract Carbon based epoxy conductive adhesive is widely used in electronic industry, and the study of its reaction kinetics has important theoretical and application significance. Curing kinetics of the conductive adhesive system was studied by non-isothermal differential scanning calorimeters (DSC). According to the Kissinger method, the apparent activation energy of the curing reaction was 57.6 kJ/mol. By the Starink isoconversion method for the conductive adhesive, the changes of activation energy (E) versus conversion (α) were obtained, and it was pointed out that the activation energy of the conductive adhesive increased with the increase of the conversion, but the average activation energy was close to 57.6 kJ/mol. The Sestal-Berggren (SB) autocatalytic kinetic model and E variable autocatalytic kinetic model were used to describe the curing reaction process of the studied system. Compared with the SB autocatalytic model, the E variable autocatalytic kinetic model showed a good agreement with experimental data of the conductive adhesive. The obtained model can be used in the calculation of the curing process of the conductive adhesive and provides theoretical guidance for the application of the conductive adhesive.

Key words： conductive adhesive curing kinetic epoxy resin isoconversion method E variable autocatalytic kinetic model

Published: 25 April 2023 Online: 2023-04-24

CLC number:

O643.1

Fund:National Natural Science Foundation of China (52071192), Shanxi Science and Technology Major Project(20181102003), Young Science Foundation of Gansu Province (20JR5RE647), and Key Research Plan of Datong City(2020013).

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	Articles by authors
	ZHANG Jin
	TAN Lu
	XING Baoyan
	LI Zuopeng
	ZHAO Jianguo
	QU Wenshan
	ZHANG Lu

Cite this article:

ZHANG Jin,TAN Lu,XING Baoyan, et al. Kinetics of Epoxy Conductive Adhesive and Its Application[J]. Materials Reports, 2023, 37(8): 22020025-6.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.22020025 OR http://www.mater-rep.com/EN/Y2023/V37/I8/22020025

1 Zhang B. Study on preparation and properties of isotropic conductive adhesive nanocomposites with high performance. Master's Thesis, Beijing University of Chemical Technology, China, 2011 (in Chinese).
张博. 高性能纳米复合各项同性导电胶的制备与性能研究. 硕士学位论文, 北京化工大学, 2011.
2 Ke Y P. Research on high performance silver conductive adhesive for microelectronic assembly. Master's Thesis, Central South University, China, 2008 (in Chinese).
柯于鹏. 微电子组装用高性能银粉导电胶研究. 硕士学位论文, 中南大学, 2008.
3 Masaebi N, Peighambardoust S J, Ahadzadeh I. Journal of Materials Science, 2018, 29(14), 11840.
4 Si P, Trinidad J, Chen L, et al. Journal of Materials Science, 2018, 29, 1837.
5 Ma C G, Xi D Y, Liu M. Journal of Composite Materials, 2013, 47, 1153.
6 Schueler R, Petermann J, Schulte K, et al. Wiley, 1996, 104(1), 261.
7 Yang X, He W, Wang S, et al. Journal of Materials Science, 2012, 23, 108.
8 Zhao J, Zhang D. Polymer Composites, 2017, 38(5), 846.
9 Mei K W, Li J W, Liao Y H, et al. Chemical Industry Time, 2021, 35(7), 7(in Chinese).
梅凯文, 李嘉炜, 廖宇恒, 等. 化工时刊. 2021, 35(7), 7.
10 Wan J, Bu Z, Xu C, et al. Chemical Engineering Journal, 2011, 171(1), 357.
11 He X, Wang J, Wang Y, et al. European Polymer Journal, 2013, 49(9), 2759
12 Zhang J, Dong H, Tong L, et al. Thermochimica Acta, 2012, 549, 63.
13 Dong H X, Zhao Q C, Zhang J, et al. CIESC Journal, 2014, 65(11), 4392(in Chinese).
董红星, 赵庆晨, 张进, 等. 化工学报, 2014, 65(11), 4392.
14 Vyazovkin S, Burnham A K, Criado J M, et al. Thermochimica Acta, 2011, 520(1), 1.
15 Chen J, Zhang W, Li X, et al. Journal of Testing and Evaluation, 2014, 42(2), 298.
16 Zhou T, Gu M, Jin Y, et al. Polymer, 2005, 46(16), 6174.
17 Wang D N, Guo B D, Yang C M. Electronics & Packaging, 2020, 20(9), 12(in Chinese).
王殿年, 郭本东, 杨春梅. 电子与封装, 2020, 20(9), 12.
18 Hu R Z, Shi Q Z. Thermal analysis kinetics, Science Press, China, 2008, pp.65(in Chinese).
胡荣祖,史启祯.热分析动力学, 科学出版社, 2008, pp.65.
19 Kandelbauer A, Wuzella G, Mahendran A, et al. Chemical Engineering Journal, 2009, 152(2), 556.
20 Wan J, Li C, Bu Z, et al. Chemical Engineering Journal, 2012, 188, 160.
21 Starink M J. Thermochimica Acta, 2003, 404(1-2), 163.
22 Wu F, Zhou X, Yu X. RSC Advances, 2018, 8(15), 8248.
23 Xiong X, Zhou L, Ren R, et al. Polymer Testing, 2018, 68, 46.
24 Blanco M, Corcuera M A, Riccardi C C, et al. Polymer, 2005, 46(19), 7989.
25 Zhang W J, Zhang Z G, Sun Z J, et al. Acta Polymerica Sinica, 2006(4), 564(in Chinese).
赵卫娟, 张佐光, 孙志杰, 等. 高分子学报, 2006(4), 564.
26 Zhang G, Cheng J, Shi L, et al. Thermochimica Acta, 2012, 538, 36.
27 Yoo M J, Kim S H, Park S D, et al. European Polymer Journal, 2010, 46(5), 1158.
28 Zhang J. Study on curing kinetics and process optimization of CMC/epoxy resin. Ph.D. Thesis,Harbin Engineering University, China, 2013 (in Chinese).
张进. CMC/环氧树脂固化动力学及工艺优化研究. 博士学位论文, 哈尔滨工程大学, 2013.
29 Sun G, Sun H, Liu Y, et al.Polymer, 2007, 48(1), 330.