耐400 ℃高温氰酸酯导电胶的制备与性能

doi:10.11896/cldb.21060190

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Abstract To restrain the chip debonding and gas production in package caused by high temperature welding during the chip sealing, cyanate ester conductive adhesive(CECA)with high temperature resistance of 400 ℃ was prepared using high purity flake silver powder as filler and cyanate ester resin as matrix. The microstructure analysis results show that Ag flakes were randomly distributed in the cyanate ester matrix, forming a good thermal and electric conductive network, and removing the organic matter on the surface of Ag powders can effectively inhibit the generation of bubbles and cracks, after the CECA was bonded and cured. Thermogravimetric analysis results show that the weight loss rate of the conductive adhesive is only 0.06% at 300 ℃ and less than 0.3% at 400 ℃, which are far lower than the current weight loss rate of conductive adhesive at the same temperature. The results of thermal performance test show that the T_g of conductive adhesive is 240 ℃, and the CTE is 51.2×10^-6/℃ below T_g and 162.2×10^-6/ ℃ above T_g. What's more, the environmental test and mechanical properties test show that the adhesive has strong adhesive strength and environmental adaptability. When the curing temperature is 330 ℃, the average chip shear strength is up to 18.4 MPa. In conclusion, the CECA prepared in this paper has excellent comprehensive properties, which provides an important reference for the development and application of high temperature conductive adhesive.

Key words： high temperature resistant conductive adhesive cyanate bonding property thermal physical property electrical conductivity

Published: 10 March 2023 Online: 2023-03-14

CLC number:

TQ437

Fund:National Natural Science Foundation of China (22078100, 52102098).

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	Articles by authors
	SUN Yikun
	ZHU Zhaoxian
	WANG Tao
	NIU Bo
	LONG Donghui

Cite this article:

SUN Yikun,ZHU Zhaoxian,WANG Tao, et al. Preparation and Properties of Cyanate Ester Conductive Adhesive Resistant to 400 ℃[J]. Materials Reports, 2023, 37(5): 21060190-5.

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http://www.mater-rep.com/EN/10.11896/cldb.21060190 OR http://www.mater-rep.com/EN/Y2023/V37/I5/21060190

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