Materials Reports  2022, Vol. 36 Issue (1): 20100132-5     https://doi.org/10.11896/cldb.20100132
METALS AND METAL MATRIX COMPOSITES |
Effect of Transient Current Bonding on Interfacial Reaction in the Sn-Ag-Cu Solder Joints
YANG Jiahang1,2, HAN Yongdian1,2, XU Lianyong1,2
1 School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
2 Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China