METALS AND METAL MATRIX COMPOSITES |
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Effect of Transient Current Bonding on Interfacial Reaction in the Sn-Ag-Cu Solder Joints |
YANG Jiahang1,2, HAN Yongdian1,2, XU Lianyong1,2
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1 School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China 2 Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China |
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Abstract In this paper,electric current was considered as the source of heating to achieve transient bonding of sandwich solder joints within hundred milliseconds. The microstructure and mechanical properties of the interface intermetallic compound (IMC) of Cu/SAC/Cu sandwich solder joints under the transient current bonding process were studied. The results showed that under the transient current bonding process, a dense IMC la-yer was formed at the Cu/SAC interface to form an effective metallurgical bond. With the increase of the current time, the morphology of the Cu6Sn5 at the Cu/SAC interface changed from short rod-prismatic-dendritic plate. The appearance of short rod-like intermetallic compound morphology at the initial interface can be explained by the Jackson factor α, and the solder joint temperature rises rapidly to reach the peak solder joint temperature of 245 ℃. As the loading time increased, the increasing peak temperature made α′(T) increase continuously. When α kept increasing until α>2, prismatic Cu6Sn5 grains were formed at the interface. With the increase of the current loading time, the interfacial dendritic plate-like Cu6Sn5 grain transition is mainly because the solute-rich region in the growth front of Cu6Sn5 crystal formed the component supercooling region caused by the increasing of bonding time and electron wind, which made the gradient of liquid phase line increase to cause the morphology transformation of Cu6Sn.The shear test showed that the increasing of shear strength with the increase of loading time was mainly due to the change of the interface Cu6Sn5 grain morphology which made the ductile fracture change to ductile-brittle mixed fracture.
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Published: 13 January 2022
Online: 2022-01-13
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Fund:This work was financially supported by the National Natural Science Foundation of China (51974198). |
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