Mg对Sn-0.7Cu钎料组织及性能的影响

doi:10.11896/cldb.20060107

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Abstract The effect of Mg element on the microstructure, melting characteristics, wettability and mechanical properties of Sn-0.7Cu eutectic solders were investigated. The results show that a proper addition of the Mg element refines the eutectic structure of the solders,while excessive addition results in the disappearance of the eutectic structure, and the transformation of Cu₆Sn₅ from fine particles to short rods. The melting point of the solders decreases significantly with the increasing addition of Mg element and it decreases to 222.58 ℃ with 1.0wt% Mg. The melting range increases and the degree of supercooling increases first and then decreases with the increasing addition of the Mg element. The wettability of sol-ders first increase and then decrease with the increase of Mg element. When the content of Mg element reaches to 0.1wt%, best wetting perfor-mance can be found with an spreading area of 85.74 mm² and an increase by 4.37% compared with Sn-0.7Cu solder can be obtained. In addition, the microhardness of Sn-0.7Cu-xMg solder can significantly increase with the addition of the Mg element and reached the maximum value at 1.0wt% Mg, increasing by 17.2%.

Key words： Sn-0.7Cu Mg element wettability microstructure microhardness

Published: 04 June 2021

CLC number:

TG425

Fund:Leading Talents of Zhongyuan Technology Innovation (ZYQR20180030), Zhengzhou Major Science and Technology Innovation Project (2019CXZX0065).

About author:: Meng Wang, a master's degree student, studied at the Zhengzhou Institute of Mechanical Research of the China Academy of Mechanical Science in September 2018, mainly engaged in the development of new brazing materials.
Sujuan Zhong, executive deputy director of the State Key Laboratory of Advanced Brazing Materials and Technology, Henan Academic Technology Leader, Zhengzhou Young Technology Expert, Zhengzhou City Women Technology Leader, has hosted and participated in 21 major national and local scientific and technological projects. She has made a lot of important researches in the research and development of harmless brazing filler metal, clean brazing filler metal, composite brazing filler metal, powdered brazing filler metal, and high-reliability brazing technology in harsh environment. 49 awards were awarded, more than 40 papers were written and published, and 41 invention patents were authorized.

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	WANG Meng
	ZHANG Guanxing
	ZHONG Sujuan
	CHENG Zhan
	LI Wenbin

Cite this article:

WANG Meng,ZHANG Guanxing,ZHONG Sujuan, et al. Effect of Mg on the Microstructure and Properties of Sn-0.7Cu Solders[J]. Materials Reports, 2021, 35(10): 10147-10151.

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http://www.mater-rep.com/EN/10.11896/cldb.20060107 OR http://www.mater-rep.com/EN/Y2021/V35/I10/10147

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