高导热环氧树脂的研究进展

doi:10.11896/cldb.20050180

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Abstract Package is an important part of electrical engineering and electronics industry. Packaging materials are one of the key factors that decide the success or failure of packaging and product performance. Polymer packaging materials are as reliable as metals and ceramics, and have simple forming technology and obvious price advantages, so become the current mainstream packaging materials. EP accounts for more than 90% of the entire electronic packaging materials because of it's small shrinkage, good heat resistance, good sealing and excellent electrical insulation. In recent years, with the continuous improvement of power density with power equipment, the development of miniaturization with electronic devices and the development trend changes to high temperature, high-pressure and high frequency fields. The low thermal conductivity of pure epoxy resin makes difficult to release the heat produced by the miniaturized ultra-large-scale integrated circuit and the operation of the motor, which causes the reliability of the device to be reduced and the life span is shortened. To develop high thermal conductivity epoxy resin packaging materials has become an inevitable choice. High thermal conductivity epoxy resin includes intrinsic thermal conductivity epoxy resin and filled thermal conductivity epoxy composite mate-rials. At present, the research hot spots of intrinsic thermal conductive epoxy resin is chemical synthesis of rigid molecular chains or small molecular monomers that are easy to crystallize and the introduction of liquid crystal structures on the molecular chains to improve the crystallinity of epoxy resins and reduce phonon scattering. Filled thermally conductive epoxy resin builds a thermal conduction pathway to improve thermal conductivity by adding a high thermal conductivity filler to the epoxy matrix. However, it is often impossible to build an effective thermal conduction pathway at low filling, and increasing filler content will affect the material processability and mechanical properties. In comparison to simple blen-ding, constructing a 3D frame with nano-fillers can greatly improve the heat transfer performance of the polymer, but it often requires a special technology to remove the template. This article reviews the current research status of the thermal conductivity of epoxy resins in recent years. Firstly, illustrating the preparation methods of two types of thermally conductive epoxy resins, and focusing on the improvement mechanism of thermal conductivity. Then, the effect of the size, shape and distribution of the high thermal conductive filler on the thermal conductivity of the filled epoxy resin is described. Finally, it introduces several issues that people should address and predicts the prospect of the research on thermal conductive epoxy resin in future.

Key words： epoxy resin liquid crystal structure thermal conduction pathway nano-fillers

Published: 14 July 2021

CLC number:

TM215.92

About author:: Jiaxue Wu is currently pursuing her M.S. degree at the major of high voltage insulation engineering under the supervision of Prof. Qingguo Chi in Harbin University of Science and Technology. Her research has focused on filled epoxy resin with high thermal conductivity.
Qingguo Chi, Male, born in 1981, Ph.D, professor, research direction is nano-dielectric and insulation.

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	WU Jiaxue
	ZHANG Tiandong
	ZHANG Changhai
	FENG Yu
	CHI Qingguo
	CHEN Qingguo

Cite this article:

WU Jiaxue,ZHANG Tiandong,ZHANG Changhai, et al. Research Status of Epoxy Resin with High Thermal Conductivity[J]. Materials Reports, 2021, 35(13): 13198-13204.

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http://www.mater-rep.com/EN/10.11896/cldb.20050180 OR http://www.mater-rep.com/EN/Y2021/V35/I13/13198

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