水冷条件下WAAM温度场的数值模拟研究

doi:10.11896/cldb.20010070

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Abstract In order to solve the problem of serious heat accumulation caused by the poor heat dissipation condition of the substrate during the process of gas metal wire arc additive manufacturing (WAAM), the heat dissipation method of the substrate with water-cooling copper plate was used to improve the heat dissipation condition of the additive process. The temperature field change of additive manufacturing under the conditions of water cooling and without water cooling are simulated respectively using Abaqus software, and the simulation process is verified experimentally. The results show that the thermal cycle curve of the measurement point of the substrate under the experimental conditions is basically consistent with the simulation result. In both conditions with and without water cooling, the substrate temperature reached the maximum at the seventh layer, and the expanding of the high temperature area on the substrate was the largest. The cooling speed of the substrate under water cooling was much faster than that without water cooling, and the “double peak” effect was more obvious. When the first layer to the seventh layer are stacked, the average temperature gradient distribution of each layer with or without water cooling gradually decreases, but the former is always greater than the latter, and the volume of the molten pool continues to increase. During the seventh to tenth layers, the heat accumulation of the formed part is close to saturation, and it is most prone to severe collapse at this stage.

Key words： water-cooling condition WAAM temperature field numerical simulation temperature gradient

Published: 23 February 2021

CLC number:

TG402

Corresponding Authors: chenkx@lut.edu.cn

About author:: Kexuan Chen a professor in School of Materials Science and Engineering of Lanzhou University of Technology and a master tutor, has trained or co-trained more than 30 graduate students. He has presided over and participated in the completion of more than 10 provincial and national natural science fund projects, provincial scientific and technological research projects and major horizontal scientific research projects respectively,and has successively won the third prize for scientific and technological progress of the State Administration of Machinery Industry, the first prize for outstanding achievements in the development and application of provincial electronic information system technology, the first prize for provincial scientific and technological progress, and the university's "three education" award, outstanding author of the journal, and "Challenge Cup" outstanding instructor honorary titles. He has been serving as a member of the Fusion Welding Professional Committee of the Chinese Welding Society and a member of the National Association for the Study of Textbooks. At present, he is mainly engaged in the research of new arc welding power sources and intelligent control, welding process control and computer applications, and arc additive manufacturing equipment and processes.
Xiangyu Wang admitted to School of Material Science and Engineering of Lanzhou University of Technology in September 2017, master degree candidates. From October 2018 to May 2019, he has participated in and completed the "Automatic Plasma Spray Welding Equipment Development" project. Currently he is mainly engaging in research work on arc additive manufacturing process and simulation.

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	CHEN Kexuan
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Cite this article:

CHEN Kexuan,WANG Xiangyu,LI Yizhao, et al. Numerical Simulation of WAAM Temperature Field Under Water Cooling[J]. Materials Reports, 2021, 35(4): 4165-4169.

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http://www.mater-rep.com/EN/10.11896/cldb.20010070 OR http://www.mater-rep.com/EN/Y2021/V35/I4/4165

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