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材料导报  2024, Vol. 38 Issue (4): 22090302-6    https://doi.org/10.11896/cldb.22090302
  金属与金属基复合材料 |
连接温度对W/Ni/Kovar真空扩散连接接头界面结构及结合强度的影响
仵金玲, 刘思雨, 张彪, 魏智磊, 史忠旗*
西安交通大学金属材料强度国家重点实验室,西安 710049
Effect of Welding Temperature on the Interface Microstructure and Bonding Strength of W/Ni/Kovar Joint by Vacuum Diffusion Welding
WU Jinling, LIU Siyu, ZHANG Biao, WEI Zhilei, SHI Zhongqi*
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
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摘要 以Ni箔为中间层材料,采用真空扩散连接方法进行W与Kovar合金的连接,研究了连接温度对W/Ni/Kovar接头界面结构和剪切强度的影响。结果表明:在520～1 000 ℃范围内,利用真空扩散连接工艺均可成功制备出W/Ni/Kovar接头样品。随着连接温度的升高,Kovar/Ni界面与Ni/W界面的扩散层厚度逐渐增加,而接头剪切强度呈先上升后下降的趋势。当连接温度为800 ℃时,样品的接头剪切强度高达182 MPa,此时主要发生W块体的剪切断裂。
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仵金玲
刘思雨
张彪
魏智磊
史忠旗
关键词:  真空扩散焊  剪切强度  钨  Kovar合金  中间层    
Abstract: The interfacial structure and shear strength of W/Ni/Kovar joint were studied by means of vacuum diffusion bonding with Ni foil as the interlayer material. The effect of welding temperature on the interface structure and shear strength of W/Ni/Kovar joint was studied. The results show that W/Ni/Kovar joint samples can be successfully prepared by vacuum diffusion bonding process in the range of 520 ℃ to 1 000 ℃. The thickness of diffusion layer between Kovar/Ni interfaces and Ni/W interfaces increased gradually with the increase of welding temperature, while the shear strength of the joint increased first and then decreased. When the temperature was 800 ℃, the shear strength of the joint sample was up to 182 MPa. At this time, the shear fracture of W block mainly occurred in the joint sample.
Key words:  vacuum diffusion welding    sheer strength    tungsten    Kovar alloy    interlayer
出版日期:  2024-02-25      发布日期:  2024-03-01
ZTFLH:  TG453  
基金资助: 国家重点研发计划项目(2018YFB0905600);陕西省自然科学基础研究计划项目(2023-JC-JQ-29)
通讯作者:  *史忠旗,西安交通大学材料科学与工程学院教授、博士研究生导师。2009年于西安交通大学材料科学与工程专业博士毕业,之后在西安交通大学材料科学与工程学院工作至今。目前主要从事结构/功能一体化陶瓷材料等方面的研究。发表论文160余篇,包括Nano Energy、Advanced Science、Carbon、Composites Science and Technology、Journal of the European Ceramic Society、Journal of Advanced Ceramics、Journal of Materials Science & Technology、《硅酸盐学报》等。zhongqishi@mail.xjtu.edu.cn   
作者简介:  仵金玲,2020年6月毕业于石家庄铁道大学获得工学学士学位。现为西安交通大学材料科学与工程学院硕士研究生,在史忠旗教授的指导下进行研究。目前主要研究领域为陶瓷表面金属化及异种材料连接。
引用本文:    
仵金玲, 刘思雨, 张彪, 魏智磊, 史忠旗. 连接温度对W/Ni/Kovar真空扩散连接接头界面结构及结合强度的影响[J]. 材料导报, 2024, 38(4): 22090302-6.
WU Jinling, LIU Siyu, ZHANG Biao, WEI Zhilei, SHI Zhongqi. Effect of Welding Temperature on the Interface Microstructure and Bonding Strength of W/Ni/Kovar Joint by Vacuum Diffusion Welding. Materials Reports, 2024, 38(4): 22090302-6.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.22090302  或          http://www.mater-rep.com/CN/Y2024/V38/I4/22090302
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