铅基巴氏合金热变形行为与微观组织演变

doi:10.11896/cldb.24090020

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Abstract The thermal deformation behavior of the Pb-9%Sb-2%Sn alloy at temperatures ranging from 50 ℃ to 200 ℃ and strain rates from 0.01 s^-1 to 10 s^-1 was investigated by thermal simulation tests, and its constitutive equation was developed. Using strain compensation to refine the equation, a thermal processing diagram was established. The microstructures of the alloy under various deformation conditions were analyzed, and combined with the thermal processing diagram, the optimal processing window for the alloy was determined, that is at temperatures ranging from 150 ℃ to 200 ℃ and strain rates from 1 s^-1 to 10 s^-1, and within which the precipitated phase is broken, rearranged, and uniformly distributed. The relationship between microstructural evolution and material properties during thermal deformation was also discussed.

Key words： Pb-Sb-Sn alloy hot deformation constitutive equations processing diagram precipitation phase fragmentation

Published: 25 November 2025 Online: 2025-11-14

CLC number:

TG146.1

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	Articles by authors
	LIU Rui
	YANG Chuan
	SHI Chengcheng
	CUI Xuchang
	LIU Huan
	WANG Ruyue

Cite this article:

LIU Rui,YANG Chuan,SHI Chengcheng, et al. Heat Deformation Behavior and Microstructural Evolution of Lead-based Pasteurized Alloy[J]. Materials Reports, 2025, 39(22): 24090020-8.

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https://www.mater-rep.com/EN/10.11896/cldb.24090020 OR https://www.mater-rep.com/EN/Y2025/V39/I22/24090020

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