钴化学机械抛光中抛光液及清洗剂的研究进展

doi:10.11896/cldb.24090050

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Abstract In the rapidly evolving landscape of integrated circuit technology, as process nodes continue to shrink to the nanometer level, the demands placed on interconnect materials and their processing technology are becoming increasingly stringent. Cobalt (Co), an emerging metal material, is gaining traction as a preferred choice forcopper (Cu) interconnect barrier layers and potential interconnect materials due to its exceptio-nal thermal stability, void-free filling ability, and strong adhesion to Cu wiring. However, this heightened interest in cobalt is accompanied by a high demand for surface smoothness and cleanliness, driving extensive research and innovation in chemomechanical polishing (CMP) processes and post CMP cleaning process. This paper aims to review the current application status of Co as Cu interconnect barrier and new interconnect material in integrated circuits, respectively. The impact of various slurry components on the material removal rate, galvanic corrosion, and removal selection ratio in CMP process are analyzed. Furthermore, the crucial role of cleaning solutions is discussed in post CMP cleaning process. Through precise chemical formula design, defects such as nanoparticles and organic residues can be effectively removed to ensure that the Co surface achieves high levels of cleanliness and flatness. Additionally, the review identifies the limitations of current research and offers forward-looking insights into the development of more environmentally friendly and efficient Co CMP and post-CMP cleaning technologies.

Key words： chemomechanical polishing cobalt barrier layer interconnection wiring polishing slurry cleaning solution

Published: 25 March 2025 Online: 2025-03-24

CLC number:	TN305.2
	TQ421.4

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	Articles by authors
	ZHANG Lifei
	LU Xinchun
	ZHANG Jialei
	ZHAO Dewen

Cite this article:

ZHANG Lifei,LU Xinchun,ZHANG Jialei, et al. Research Progress of Polishing Slurry and Cleaning Solution in Chemomechanical Polishing Process for Cobalt[J]. Materials Reports, 2025, 39(6): 24090050-10.

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https://www.mater-rep.com/EN/10.11896/cldb.24090050 OR https://www.mater-rep.com/EN/Y2025/V39/I6/24090050

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