RESEARCH PAPER |
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Study on Electropolishing of Hastelloy C-276 Alloy |
WANG Yi1, WANG Pan1, SUO Hongli1, JIA Qiang1, LU Dongqi1, LI Huaizhou2, WU Haiming1
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1 Key Laboratory of Advanced Functional Materials, Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124; 2 The Capital Aerospace Machinery Company, Beijing 100076; |
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Abstract The environmental friendly polishing liquid was used to polish the surface of Hastelloy C-276 alloy substrate, which was used for the technical route of ion beam assisted deposition (IBAD).The typical curve of anodic polarization was obtained, and the mechanism of electrochemical polishing was described. The effect of electrochemical polishing elements (such as electrolytic polishing temperature, polishing time and polishing distance) on the roughness of substrate′s surface was investigated. The high quality surface with the roughness lower than 5 nm (in the area of 5 μm×5 μm) was obtained via the optimized polishing processes, which satisfied to the requirements of surface roughness for the subsequent deposition by IBAD. Citric acid in polishing liquid decomposed into a complexing agent at about 50 ℃, which could accelerate the precipitation of metal ions and increase the reactivity of surface.
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Published: 25 January 2017
Online: 2018-05-02
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1 Kim K T, et al. Development of cube-textured Ni-W alloy substrates for YBCO-coated conductor[J]. Physica C,2004,412(9):859. 2 Celentano G, Varesi E, Petrison T, et al. Influence of the substrate microstructure on the superconducting properties of YBCO coated conductors[J]. IEEE Trans Appl Supercond,2003,13(2):2591. 3 Teranishi R, Izumi T, Shiohara Y. Highlights of coated conductor development in Japan[J]. Supercond Sci Technol,2006,19(3):4. 4 Fenga F, Shia K, Xiaoa S Z, et al. Fractal analysis and atomic force microscopy measurements of surface roughness for Hastelloy C276 substrates and amorphous alumina buffer layers in coated conductors[J]. Appl Surf Sci,2012,258(8):3502. 5 Sarma V S, Boer B, Reger N, et al. Ni and Ni-alloy tapes with a very strong cube texture as substrates for high temperature superconducting tapes[J]. Mater Sci Forum,2002,408:1561. 6 Prusseit W,Nemetschek R,Hoffmann C, et al. ISD process development for coated conductors[J]. Physica C,2005,426:866. 7 Wang Q Y, Bai S L, Zhao Y H, et al. Effect of mechanical polishing on corrosion behavior of Hastelloy C22 coating prepared by high po-wer diode laser cladding[J]. Appl Surf Sci,2014,303(6):312. 8 Hu Y N, et al. Surface quality analysis of the electropolishing of cemented carbide[J]. J Mater Processing Technol,2013,139(1):253. 9 Hryniewicz T,Rokosz K,Rokicki R. Electrochemical and XPS stu-dies of AISI 316L stainless steel after electropolishing in a magnetic field[J].Corros Sci,2008,50:2676. 10 Fang J L. Polishing technology of metal materials[M]. Beijing: National Defence Industry Press,2005:76. 11 Wang X, et al. Electropolishing of Ni-5at.%W substrates for YBCO coated conductors [J]. Mater Chem Phys,2012,133(1):212. 12 Feng F, Liu R, Chen H, et al. Substrate surface treatment and YSZ buffer layers by IBAD method for coated conductors[J]. Physica C,2009,469(15-20):1367. 13 Alanis I L, Schiffrin D J. The influence of mass transfer on the mechanism of electropolishing of nickel in aqueous sulphuric acid[J]. Electrochimica Acta,1982,27(7):837.
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