高性能电路用电容东南沿海大气环境失效行为研究

doi:10.11896/cldb.25070225

Abstract
Figure/Table
References
Related Citation (8)

Download:

Full Text ( PDF ) (13370KB)
Export: BibTeX | EndNote (RIS)

Abstract To evaluate the impact of the atmospheric environment in the China southeast coastal region on the reliability of gyroscope power boards and improve their environmental adaptability, accelerated stress tests were performed, including combined moist heat-salt spray-dry-wet alternation tests and moist heat tests. Results indicated abnormal output voltage from the power board after 46 days under moist heat conditions and 25 days under combined cyclic testing. The failure was traced to insulation degradation in tantalum capacitors. The failed capacitors showed signs of solder joint corrosion, case cracking, and ablation marks. Analysis revealed that moisture and salt spray penetrated the non-hermetic epoxy casing, accumulating at the epoxy-silver interface and within the porous MnO₂ layer, leading to crack formation. Under applied voltage, moisture and chloride ions in the cracks became conductive, generating intense Joule heating that caused localized breakdown of the Ta₂O₅ dielectric layer — particularly at its thinner edge regions — resulting in a short circuit between the tantalum anode and the MnO₂ cathode. The failure mechanism involved the intrusion and accumulation of environmental contaminants (H₂O, Cl^-) in vulnerable regions, which became conductive paths under electrical bias, leading to thermal breakdown. Chloride ions notably increased dielectric conductivity, intensifying Joule heating and accelerating failure. Enhancing the sealing integrity at the epoxy-silver interface and minimizing salt spray exposure could effectively delay failure and improve the power board′s suitability for southeastern coastal environments.

Key words： tantalum capacitor southeast coast moist heat-salt spray-dry-wet alternation test short circuit atmospheric environment failure behavior

Published: 10 September 2026 Online: 2026-09-22

CLC number:

TG147

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	WEI Xiaoqin
	LI Han
	ZHOU Rui
	XIE Changcheng
	NING Honglong

Cite this article:

WEI Xiaoqin,LI Han,ZHOU Rui, et al. Study on Failure Behavior of Capacitors for High-performance Circuits Under
China Southeast Coastal Atmospheric Conditions[J]. Materials Reports, 2026, 40(17): 25070225-5.

URL:

https://www.mater-rep.com/EN/10.11896/cldb.25070225 OR https://www.mater-rep.com/EN/Y2026/V40/I17/25070225

1 Schaper L W, Thomason C. IEEE Transactions on Components and Pac-kaging Technologies, 2007, 30(4), 563.
2 Prymak J D. In:Proceedings of PCIM Conference. Japan, 1998.
3 Yang W H, Ma T S, Li Z, et al. Journal of Functional Materials, 2011, 42(3), 479 (in Chinese).
杨文徽, 马腾双, 李滞, 等. 功能材料, 2011, 42(3), 479.
4 Li J. A study of tantalum capacitormanganizing technology. Ph. D. Thesis, Xidian University, China, 2014 (in Chinese).
李俊. 钽电容器被膜技术研究. 博士学位论文, 西安电子科技大学, 2014.
5 Wang X H. Natural environment test technology, Aviation Industry Press, China, 2003 (in Chinese).
汪学华. 自然环境试验技术, 航空工业出版社, 2003.
6 Virkki J, Raumonen P. Active and Passive Electronic Components, 2011, 2011, 108423.
7 Qu X X. Electronic Components & Materials, 1988, 7(4), 61 (in Chinese).
曲喜新. 电子元件与材料, 1988, 7(4), 61.
8 Cheng G, Sun J. Electronic Components & Materials, 2013, 32(6), 73 (in Chinese).
成钢, 孙洁. 电子元件与材料, 2013, 32(6), 73.
9 O’Malley P D, Wang D, Duong H, et al. In:Conference Record of the 55th Annual NDIAFuze Conference, Hawaii, USA, 2011, pp. 24.
10 Li B, Zhang Y, Xu J J, et al. Transactions of Beijing Institute of Technology, 2009, 29(10), 921 (in Chinese).
李波, 张亚, 徐建军, 等. 北京理工大学学报, 2009, 29(10), 921.
11 Peng B X. Electronic Product Reliability and Environmental Testing, 1999, 17(4), 22 (in Chinese).
彭宝霞. 电子产品可靠性与环境试验, 1999, 17(4), 22.
12 Zhang S L, Zhang J H, Tang W J. Microelectronics, 2008, 38(3), 389 (in Chinese).
张世莉, 张建宏, 唐万军. 微电子学, 2008, 38(3), 389.
13 Wang S Y, Jia Z Z, Wang Y. Electronics Process Technology, 2019, 40(3), 182 (in Chinese).
王世堉, 贾忠中, 王玉. 电子工艺技术, 2019, 40(3), 182.
14 Wang M. Practical Electronics, 2022, 28(8), 76 (in Chinese).
王敏. 电子制作, 2022, 28(8), 76.
15 Tian D B, Pan Q F, Zhang X H, et al. Electronic Components & Materials, 2019, 38(4), 94 (in Chinese).
田东斌, 潘齐凤, 张选红, 等. 电子元件与材料, 2019, 38(4), 94.
16 Wang S. Technology Wind, 2018, 31(1), 108 (in Chinese).
王烁. 科技风, 2018, 31(1), 108.
17 Chen S P. Failure mechanism and pressure resistance of chip solid electrolyte tantalum capacitors under different conditions. Ph. D. Thesis, Xidian University, China, 2015 (in Chinese).
陈双平. 不同条件下片式固体电解质钽电容器击穿失效机理及耐压性能研究. 博士学位论文, 西安电子科技大学, 2015.
18 Wang M Q. Quality and Reliability, 1987, 3(4), 36 (in Chinese).
王敏强. 质量与可靠性, 1987, 3(4), 36.
19 Wang L N. Computer & Digital Engineering, 2010, 38(4), 184 (in Chinese).
王鲁宁. 计算机与数字工程, 2010, 38(4), 184.
20 Chuai R Y, Shao B, Wei C C. Journal of Shenyang University of Technology, 2004, 26(5), 558 (in Chinese).
揣荣岩, 邵泊, 韦春才. 沈阳工业大学学报, 2004, 26(5), 558.
21 Teverovsky A. Greenbelt MD, NASA Goddard Space Flight Center, 2011.
22 Qiu S Q. Analysis on failure mechanism of key components offuze initiation control system and its reliability under impact. Ph. D. Thesis, Beijing Institute of Technology, China, 2016 (in Chinese).
邱士起. 冲击作用下引信起爆控制系统关键元器件失效机理及其可靠性分析. 博士学位论文, 北京理工大学, 2016.
23 Li C L, Gao S Q, Niu S H, et al. Explosion and Shock Waves, 2018, 38(2), 419 (in Chinese).
李长龙, 高世桥, 牛少华, 等. 爆炸与冲击, 2018, 38(2), 419.
24 Wang J L, Li H W, Wang X B, et al. Explosion and Shock Waves, 2024, 44(4), 15 (in Chinese).
王家乐, 李洪伟, 王小兵, 等. 爆炸与冲击, 2024, 44(4), 15.
25 Teverovsky A. Journal of Microelectronics and Electronic Packaging, 2021, 18(4), 177.
26 Teverovsky A. In:Proceedings of the 4th PCNS Passive Components Networking Symposium, Sønderborg, Denmark, 2023, pp. 8.
27 魏小琴, 蒲亚博, 李念林, 等. 中国专利, ZL201911366253.7, 2019.
28 Chen X, Zhao S, Zhai L, et al. Journal of Electronic Packaging, 2005, 127(4), 460.
29 Liu J X, Xiao D C, Wang B R. Electronic Components & Materials, 2004, 23(3), 3 (in Chinese).
刘家欣, 肖大雏, 王宾如. 电子元件与材料, 2004, 23(3), 3.