Sn/Ni改性铜磷钎料抑制Cu<sub>3</sub>P脆性相的形成机制及接头性能研究

doi:10.11896/cldb.25070119

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Abstract Copper/brass joints were brazed using Sn/Ni-modified copper-phosphorus filler metal, and their microstructure, mechanical properties, and interfacial formation mechanism were investigated. The microstructure of the brazed joints was characterized using optical microscopy (OM), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDS). Variations in microhardness across the brazing interface were analyzed using a fully automatic microhardness tester, while thermodynamic calculations were employed to elucidate the interfacial reaction mechanism. The results indicate that the brazing interface primarily consists of Cu(s, s) (copper solid solution), Cu(s, s)+Ni₂P+Cu₃P phases, Cu-Sn solid solution, and brittle Cu₃P compounds. The interfacial microhardness distribution exhibits a characteristic pattern with higher values in the central region and lower values at the edges. Specifically, the presence of Cu₃P compounds in the brazing seam center results in a peak microhardness of 168.5HV. A diffusion layer approximately 13 μm thick forms near the copper side, exhibiting a microhardness of 103.4HV. Thermodynamic analysis reveals that the Gibbs free energy change for Ni₂P formation (ΔG_Ni₂P) is lower than that for Cu₃P (ΔG_Cu₃P). Consequently, the addition of Ni in the modified filler metal promotes preferential formation of Ni₂P at the reaction interface, which contributes to enhancing the overall performance of the joint.

Key words： brazing Cu-P brazing filler metal micro-structure mechanical property formation mechanism

Published: 10 August 2026 Online: 2026-08-31

CLC number:

TG454

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https://www.mater-rep.com/EN/10.11896/cldb.25070119 OR https://www.mater-rep.com/EN/Y2026/V40/I15/25070119

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