电子封装用纳米复合焊膏的研究进展

doi:10.11896/cldb.22010113

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Abstract As the key of the welding process, solders play an important role in the interconnection between electronic packaging devices and materials. The electronic packaging materials are forced to develop in the direction of high power density, high service temperature and high reliability as the demands of new generation power devices increase. Composite nanosolders have shown good prospects due to their low-temperature sintering, high-temperature service, and excellent electrical conductivity. In this paper, a review of current research on composite nanosolders is presented. Characteristics between the three methods used to prepare composite nanosolders are first discussed. Thereafter, the effective mec-hanism of composite nanosolders on the microstructure and properties are discussed for Sn-Ag-Cu, Sn-Cu, Ag-Cu, Sn-Zn, and Sn-Ag composite nanosolders. Finally, the limitations and developmental research trends of composite nanosolders are summarized as a reference for the future investigation of composite nanosolders with improved performance.

Key words： composite nanosolder electrochemical deposition microemulsion method aqueous chemical reduction microstructure reliability

Published: 10 October 2023 Online: 2023-09-28

CLC number:

TG42

Fund:Xi'an University of Science and Technology for Excellent Young Teschers Research Program (2018YQ2-12), the Fund of the State Key Laboratory of Solidification Processing in NWPU (SKLSP201846), and Excellent Projects Funded by Science and Technology Activities of Overseas Students in Shaanxi (201847).

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	Articles by authors
	DU Wei
	QIANG Junfeng
	YU Zhuhuan
	GAO Wei
	YAN Yawen
	WANG Xiaohui
	LIU Xuliang

Cite this article:

DU Wei,QIANG Junfeng,YU Zhuhuan, et al. Research Progress of Composite Nanosolders for Electronic Packaging[J]. Materials Reports, 2023, 37(19): 22010113-11.

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http://www.mater-rep.com/EN/10.11896/cldb.22010113 OR http://www.mater-rep.com/EN/Y2023/V37/I19/22010113

1 Zhu M S, Zhu F, Schmidt O G. Nano Materials Science, 2021, 3, 107.
2 Wang J H, Xue S B, Lyu Z P, et al. Materials Reports, 2019, 33(7), 2133 (in Chinese).
王剑豪, 薛松柏, 吕兆萍, 等. 材料导报, 2019, 33(7), 2133.
3 Zou G S, Lin L C, Xiao Y, et al. Chinese Journal of Lasers, 2021, 48(15), 128 (in Chinese).
邹贵生, 林路禅, 肖宇, 等. 中国激光, 2021, 48(15), 128.
4 Wang J H, Xue S B, Zhang P, et al. Journal of Materials Science, 2019, 30, 9065.
5 Jiang Z, Tian Y H, Ding S. Acta Metallurgica Sinica, 2016, 52(1), 105 (in Chinese).
江智, 田艳红, 丁苏. 金属学报, 2016, 52(1), 105.
6 Zeng C, Cui X H, Liao C J, et al. Micronanoelectronic Technology, 2021, 58(10), 866 (in Chinese).
曾策, 崔西会, 廖承举, 等. 微纳电子技术, 2021, 58(10), 866.
7 Wu W Z, Yang F, Hu B, et al. Transactions of the China Welding Institution, 2021, 42(1), 83 (in Chinese).
吴炜祯, 杨帆, 胡博, 等. 焊接学报, 2021, 42(1), 83.
8 Zheng Z, Yang F, Wang C Q. In:Conference Record of the 2016 IEEE 17th International Conference on Electronic Packaging Technology. Wuhan, China, 2016, pp. 849.
9 Li J J, Shi T L, Yu X, et al. In:Conference Record of the 2017 IEEE 67th Electronic Components and Technology Conference. Orlando, 2017, pp. 976.
10 Yu H, Li L L, Zhang Y J. Scripta Materialia, 2012, 66, 931.
11 Li J J, Cheng C L, Shi T L, et al. Materials Letters, 2016, 184, 193.
12 Khazaka R, Mendizabal L, Henry D. Journal of Electronic Materials, 2014, 43, 2459.
13 Morisada Y, Nagaoka T, Fukusumi M, et al. Journal of Electronic Materials, 2010, 39, 1283.
14 Yi J B, Pan H, Lin J Y, et al. Advanced Materials, 2008, 20, 1170.
15 Liu W J, Lei W N, Qu N S, et al. Rare Metal Materials and Engineering, 2010, 39(11), 2064 (in Chinese).
刘维桥, 雷卫宁, 曲宁松, 等. 稀有金属材料与工程, 2010, 39(11), 2064.
16 Zhang X. Synthesis, characterization and nanosoldering application of Sn-Cu-based nanosolders. Ph. D. Thesis, Lanzhou University, China, 2019 (in Chinese).
张悬. 锡铜系纳米焊料制备、表征及纳米焊接应用. 博士学位论文, 兰州大学, 2019.
17 Takahashi K, Limmer S J, Wang Y, et al. American Chemical Society, 2004, 108, 9795.
18 Feng J, Zhang C P. Journal of Analytical Atomic Spectrometry, 2006, 293, 414.
19 Sharma G, Kumar D, Kumar A, et al. Materials Science & Engineering C, 2016, 11, 2.
20 Gao B J, Gao J F, Zhou J Q, et al. Chinese Journal of Inorganic Chemistry, 2001, 17(4), 491 (in Chinese).
高保娇, 高建峰, 周加其, 等. 无机化学学报, 2001, 17(4), 491.
21 Zhou D B, Tu S Q, Ren Z W, et al. Journal of Central South University (Science and Technology), 2007, 38(4), 706 (in Chinese).
周德璧, 屠赛琦, 任志伟, 等. 中南大学学报(自然科学版), 2007, 38(4), 706.
22 Foo S P, Siow K S, Jalar A. In:Conference Record of the 2014 IEEE International Conference on Semiconductor Electronics. Kuala Lumpur, 2014, pp. 513.
23 Wang Y. Synthesis of nano-SnAgCu solder by microemulsion method.Master' Thesis, China Jiliang University, China, 2019 (in Chinese).
王艳. 微乳法合成纳米SnAgCu焊料. 硕士学位论文, 中国计量大学, 2019.
24 Teng Y, Yan F C, Li W L, et al. Materials Reports, 2015, 29(25), 172 (in Chinese).
滕媛, 闫方存, 李文琳, 等. 材料导报, 2015, 29(25), 172.
25 Cao Y, Liu P, Wei H M, et al. Journal of Materials Engineering, 2015, 43(4), 79 (in Chinese).
曹洋, 刘平, 魏红梅, 等. 材料工程, 2015, 43(4), 79.
26 Zou C D, Gao Y L, Yang B, et al. Transactions of Nonferrous Metals Society of China, 2010, 20, 248.
27 Wang Y, Liu W X, Liu W, et al. Microelectronics Reliability, 2017, 78, 17.
28 Schmitt W, Fritzsche S, Thomas M. In:Conference Record of the 2012 IEEE 7th International Conference on Integrated Power Electronics Systems. Nuremberg, 2012, pp. 1.
29 Zhao Y M, Wu Y B, Evans K, et al. In:Conference Record of the 2014 IEEE 15th International Conference on Electronic Packaging Technology. Chengdu, 2014, pp. 200.
30 Ren H, Zhang H Q, Wang W G, et al. Chinese Journal of Lasers, 2021, 48(8), 126 (in Chinese).
任辉, 张宏强, 王文淦, 等. 中国激光, 2021, 48(8), 126.
31 Yung K C, Law C M T, Lee C P, et al. Journal of Electronic Materials, 2012, 41, 313.
32 Zou C D, Gao Y L, Yang B, et al. Journal of Materials Science:Materials in Electronics, 2012, 23, 2.
33 Liu W X. The study of SnAgCu nano solder paste.Master' Thesis, China Jiliang University, China, 2017 (in Chinese).
刘文晓. SnAgCu纳米焊膏的研究. 硕士学位论文, 中国计量大学, 2017.
34 Qiu T, Liu S L, Zhu M C, et al. Technology Innovation and Application, 2021, 11(19), 29 (in Chinese).
邱天, 刘树龙, 朱明成, 等. 科技创新与应用, 2021, 11(19), 29.
35 Hsiao L Y, Duh J G. Journal of the Electrochemical Society, 2005, 152, 150.
36 Yu X, Di T T, Shen H Y. Chinese Journal of Materials Research, 2020, 34(4), 299 (in Chinese).
俞鑫, 邸彤彤, 沈杭燕. 材料研究学报, 2020, 34(4), 299.
37 Roshanghias A, Khatibi G, Yakymovych A, et al. Journal of Electronic Materials, 2016, 45, 4390.
38 Yakymovych A, Slabon A, Svecsr P, et al. Applied Nanoscience, 2020, 10, 4603.
39 Zhang L, Tu K N. Materials Science and Engineering R, 2014, 82, 1.
40 Mehreen S U, Nogita K, McDonald S, et al. Journal of Alloys and Compounds, 2018, 6, 251.
41 Fan J L, Liu Z Y, Li Y W, et al. Materials Reports, 2018, 32(11), 3774 (in Chinese).
樊江磊, 刘占云, 李育文, 等. 材料导报, 2018, 32(11), 3774.
42 Mohd-Said R, Mohd-Salleh M A A, Saud N, et al. Journal of Materials Science:Materials in Electronics, 2020, 31, 11077.
43 Ma H W. The preparation of nano Cu₆Sn₅ solder paste and power dieattache bonding process.Master' Thesis, Harbin Institute of Technology, China, 2016 (in Chinese).
马慧文. 纳米Cu₆Sn₅焊膏制备与功率芯片贴装键合工艺. 硕士学位论文, 哈尔滨工业大学, 2017.
44 Zhang R, Tian Y H, Hang C J, et al. Materials Letters, 2013, 110, 137.
45 Chen S H, Fan G Y, Yan X, et al. In:Conference Record of the 2015 IEEE 16th International Conference on Electronic Packaging Technology. Changsha, 2015, pp. 367.
46 Kang H, Sharma A, Jung J P. Metals, 2020, 10, 934.
47 Wang H W, Sun S C, Xu Z Q, et al. Transactions of the China Welding Institution, 2012, 33(9), 77 (in Chinese).
王宏伟, 孙实春, 徐振清, 等. 焊接学报, 2012, 33(9), 77.
48 Zhong Y, An R, Wang C Q, et al. Small, 2015, 11, 4097.
49 El-Daly A A, Hammad A E. Journal of Alloys and Compounds, 2011, 509, 8554.
50 Andersson C, Sun P, Liu J. Journal of Alloys and Compounds, 2008, 457, 97.
51 Wang M, Zhang G X, Zhong S J, et al. Materials Reports, 2021, 35(10), 10147 (in Chinese).
王蒙, 张冠星, 钟素娟, 等. 材料导报, 2021, 35(10), 10147.
52 Zeng G, McDonald S D, Gu Q F, et al. Acta Materials, 2015, 83, 357.
53 Huang P C, Duh J G. Journal of Nanoscience and Nanotechnology, 2009, 9, 764.
54 Huang H Z, Lu D, Zhao J W, et al. Materials Reports, 2016, 30(7), 104 (in Chinese).
黄惠珍, 卢德, 赵骏韦, 等. 材料导报, 2016, 30(7), 104.
55 Yang F, Zhang L, Liu Z Q, et al. Hindawi Publishing Corporation, 2016, 2016, 1.
56 Gan G S, Liu C, Cheng H L, et al. Electronic Components and Materials, 2020, 39(2), 83 (in Chinese).
甘贵生, 刘聪, 程翰林, 等. 电子元件与材料, 2020, 39(2), 83.
57 Qi Y F, Huang X M, Wang L, et al. Welding & Joining, 2021, 64(1), 18 (in Chinese).
齐岳峰, 黄晓猛, 王莉, 等. 焊接, 2021, 64(1), 18.
58 Zhang X, Zhang H, Zheng X J, et al. Nanotechnology, 2019, 30, 1.
59 Shang H L, Ma B Y, Li R B, et al. Rare Metal Materials and Engineering, 2019, 48(3), 835 (in Chinese).
尚海龙, 马冰洋, 李荣斌, 等. 稀有金属材料与工程, 2019, 48(3), 835.
60 Tsaoa L C, Huang C H, Chung C H, et al. Materials Science and Engineering A, 2012, 545, 194.
61 Guo L J, Liu W, Ji X L, et al. Results in Materials, 2021, 10, 1.
62 Shi Y H. Study on the preparation and properties of micro-Ag/nano-Ag-Cu particles mixed solder paste.Master' Thesis, Harbin Institute of Technology, China, 2020 (in Chinese).
石宇皓. 微米Ag/纳米Ag-Cu颗粒混合焊膏的制备及性能研究. 硕士学位论文, 哈尔滨工业大学, 2020.
63 Yan J F, Zhang D Y, Zou G S, et al. Journal of Electronic Materials, 2019, 48, 1286.
64 Yan J F, Zou G S, Wu A P, et al. Journal of Electronic Materials, 2012, 41, 1886.
65 Liu X J. Nanoalloying and anti-electrochemical migration mechanisms of Ag-Cu supersaturated solid solution nanoparticles. Ph. D. Thesis, Harbin Institute of Technology, China, 2017 (in Chinese).
刘晓剑. Ag-Cu超饱和固溶体纳米颗粒纳米冶金及抗电化学迁移机理. 博士学位论文, 哈尔滨工业大学, 2017.
66 Wu N. Study on sintering process and properties of composite micro-nano-Cu@Ag solder paste.Master' Thesis, Harbin Institute of Technology, China, 2019 (in Chinese).
吴楠. 复合微纳米Cu@Ag焊膏烧结工艺及其性能研究. 硕士学位论文, 哈尔滨工业大学, 2019.
67 Hu K. Research on low-temperature sintering joining for Ag/Cu nanoparticle composite paste.Master' Thesis, Wuhan Institute of Technology, 2018 (in Chinese).
胡坤. 纳米Ag/Cu复合焊膏的低温烧结连接研究. 硕士学位论文, 武汉工程大学, 2018.
68 Kim J C, Ren Z Q, Yuksel A, et al. Journal of Electronic Packaging, 2021, 143, 10801.
69 Liu G Y, Wang Y G, Li X, et al. Electric Drive for Locomotives, 2021, 30(5), 1 (in Chinese).
刘国友, 王彦刚, 李想, 等. 机车电传动, 2021, 30(5), 1.
70 Dai X F, Xu W, Zhang T, et al. Chemical Engineering Journal, 2019, 364, 310.
71 Yu X, Li J J, Shi T L, et al. Journal of Alloys and Compounds, 2017, 724, 365.
72 Lee C, Kim N R, Koo J, et al. Nanotechnology, 2015, 26, 1.
73 Kim C K, Lee G J, Lee M K, et al. Powder Technology, 2014, 263, 1.
74 Jia Q, Zou G S, Wang W G, et al. ACS Applied Materials & Interfaces, 2020, 12, 16734.
75 Jia Q, Wang W G, A Z W, et al. Chinese Journal of Lasers, 2021, 48(8), 167 (in Chinese).
贾强, 王文淦, 阿占文, 等. 中国激光, 2021, 48(8), 167.
76 Kim S, Kim K, Kim S, et al. Journal of Electronic Materials, 2009, 38, 2668.
77 Li J J, Shi T L, Yu X, et al. In:Conference Record of the 2016 IEEE Electrical Design of Advanced Packaging and Systems. Honolulu, 2016, pp. 127.
78 Wang M Y, Hu W B, Sun X D, et al. Electronics & Packaging, 2021, 21(10), 106 (in Chinese).
王美玉, 胡伟波, 孙晓冬, 等. 电子与封装, 2021, 21(10), 106.
79 Zhang S Y, Bao T Y, Xiu Z Y, et al. Materials Reports, 2021, 35(2), 2133 (in Chinese).
张墅野, 鲍天宇, 修子扬, 等. 材料导报, 2021, 35(2), 2133.
80 Amin N A A M, Shnawah D A, Said S M, et al. Journal of Alloys and Compounds. 2014, 599, 114.
81 BraunovicM, Gagnon D, Rodrigue L. In:Conference Record of the 2006 IEEE Proceedings of the 52nd Holm Conference on Electrical Contacts. Montreal, 2006, pp. 117.
82 Sharma A, Sohn H R, Jung J P. Metallurgical and Materials Transactions A, 2016, 47, 494.
83 Hasnine1 M, Tolla1 B, Karasawa M. Journal of Materials Science:Materials in Electronics, 2017, 28, 16106.
84 Huang H Z, Zhou L, Wei X Q, et al. Materials Science & Technology, 2008, 16(3), 374 (in Chinese).
黄惠珍, 周浪, 魏秀琴, 等. 材料科学与工艺, 2008, 16(3), 374.
85 Mahmudi R, Geranmayeh A R, Khanbareh H, et al. Materials and Design, 2009, 30, 574.
86 Hong H, Min D. Metals and Materials International, 2021, 27, 1.
87 Suganuma K, Kim K S. Journal of Materials Science-Materials in Electronics. 2007, 18, 121.
88 Ma L. Preparation of Sn9Zn nano-composite solder and low-temperature soldering behavior on aluminum alloy. Master' Thesis, Taiyuan University of Technology, 2018 (in Chinese).
马乐. Sn9Zn纳米复合焊料制备及其低温钎焊铝合金行为. 硕士学位论文, 太原理工大学, 2018.
89 Hsin J P, Chao Y L, Udit S M, et al. Materials Sciences and Applications, 2011, 2, 1480.
90 Lina C Y, Choua J H, Lee Y G, et al. Journal of Alloys and Compounds, 2009, 470, 328.