Curing Kinetics and Fracture Toughness of BDM/DABPA System Modified by Short Glass Fiber Reinforced Polyether Ketone Ketones (PEKK-GF)
LI Hongfeng1, 2, QU Chunyan1, WANG Dezhi1, LIU Zhongliang2, GU Jiyou2, ZHANG Yang1
1 Institute of Petrochemistry Heilongjiang Academy of Sciences, Harbin 150040; 2 College of Material Science and Engineering, Northeast Forestry University, Harbin 150040
Abstract: Diphenylmethyenebismaleimide (BDM) chain was extended by diallyl bisphenol A (DABPA). Short glass fiber reinforced polyether ketone ketones (PEKK-GF) was used to modify the BDM/DABPA resin. The curing kinetics of the BDM/DABPA resin modified by PEKK-GF was investigated by non-isothermal differential scanning calorimetry (DCS). Curing process of the modified resin was determined and some kinetic parameters were calculated. The mechanical properties of the modified resin were tested by universal tensile machine. The results showed that the impact strength of the cured modified resin was improved by 69%. The plan strain critical stress intensity factor (KIC) and the plan strain critical strain energy release rate (GIC) of the modified resin could reach 1.22 MPa·m0.5 and 295 J/m2, increased by 21% and 59% respectively when 10 wt% PEKK-GF was used. Tensile strength increased from 85.21 MPa to 96.39 MPa and tensile modulus increased from 4.198 GPa to 4.531 GPa. Bending strength increased from 133.0 MPa to 140.4 MPa and bending modulus increased from 4.080 GPa to 4.251 GPa. The thermal stability was cha-racterized by dynamic mechanical analysis (DMA).The results showed that the glass transition temperature (Tg) of cured modified resin reached 263.5℃, which increased by 16.5 ℃. With these excellent performances, the modified resin may be applied to the fields of high temperature prepreg and adhesive.
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2018, Vol. 32 
