Email Alert
|
Rss
Home
Contents
Ethics
About MR
Contact us
Online preprint
Online special issues
Current issue
Archives
Ethical guidelines for authors
Ethical guidelines for reviewers
Ethical guidelines for editors
Journal profile
Editorial board
Index-in and rewarded
Author and Reader
Reviewers
Editor login
Author login
Reader login
Author infos
Reviewer registration
Reviewer login
Research Progress in the Preparation and Interface Modification of High Thermal Conductivity Diamond/Copper Composites
GUO Jing, MENG Yongqiang, SUN Jinfeng, ZHANG Shaofei
Materials Reports . 2022, (
15
): 20090233 -7 . DOI: 10.11896/cldb.20090233
渝ICP备12006835号-3
渝公网安备50019002502923号
© Editorial Office of Materials Reports.
Address: No.18 Honghu West Rd., Yubei, Chongqing, China Zip Code: 401121
E-mail: editor@mat-rev.com
渝公网安备50019002502923号 © Editorial Office of Materials Reports.
