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Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging
LIU Xuan, XU Hongyan, LI Hong, XU Ju, Hodúlová Erika, Kovaříková Ingrid
Materials Reports . 2021, (
19
): 19116 -19124 . DOI: 10.11896/cldb.20040187
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