低温等通道转角挤压中定向凝固纯铜的组织及性能演变

doi:10.11896/j.issn.1005-023X.2018.10.015

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Abstract The microstructure evolution of directional solidification structure in pure copper (99.99%) during equal channel angular pressing (ECAP) after cooling with dry ice was investigated by OM and XRD, the hardness and conductivity were tested. The results manifested that the fibrous structure with same orientation was formed in directional solidification structure in pure copper by route A and C at low temperature, and the characterization of (111) preferred orientation was remained. After deformation by route Bc, columnar crystal of directional solidification structure in pure copper was broken, and homogeneous equiaxed grains were formed, at the same time, the grain orientation tended to be random. The hardness of each route increased drastically after one pass extrusion, which was about 1.8 times in compare with hardness of original sample, with the increase of extrusion passes, the hardness increased slowly, whereas the hardness decreased slightly after four passes extrusion by route Bc. The consistency of grain orientation made the conductivity increased in the condition of low strain, however, with the increase of strain, lattice distortion caused electron scattering, which leaded to a slight decrease in conductivity.

Key words： directional solidification structure in pure copper equal channel angular pressing(ECAP) grain orientation microstructure electrical conductivity

Published: 06 July 2018

CLC number:

TG379

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	Articles by authors
	GUO Tingbiao
	LI Qi
	WANG Chen
	ZHANG Feng
	DING Yutian
	JIA Zhi
	TANG Xingchang

Cite this article:

GUO Tingbiao,LI Qi,WANG Chen, et al. The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature[J]. Materials Reports, 2018, 32(10): 1650-1654.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.10.015 OR http://www.mater-rep.com/EN/Y2018/V32/I10/1650

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