电力电子器件用液冷针翅散热器的研究进展

doi:10.11896/cldb.23070138

Abstract
Figure/Table
References
Related Citation (1)

Download:

Full Text ( PDF ) (11066KB)
Export: BibTeX | EndNote (RIS)

Abstract With the development of high-power power electronic devices (such as insulated gate bipolar transistors, IGBT) lightweight, miniaturization and integration needs, their power density is increasing, resulting in higher and higher heat flow density, which urgently needs efficient heat dissipation to meet its use requirements. Traditional air-cooled heat sinks are simple in structure and easy to use, but the heat dissipation capacity istoo low to meet the heat dissipation requirements of high heat flow density, so liquid-cooled heatsinks are mainly used at present, among these liquid-cooled pin-fin heatsinks are the most common and efficient heat dissipation facilities. Here introduces the research progress in the structure, liquid working medium, material and manufacturing of liquid-cooled pin-fin heatsinks, focuses on the influence of fluid channel structure, pin-fin structure on the flow and heat transfer performance of liquid-cooled pin-fin heatsinks, and gives suggestions for the development of liquid-cooled pin-fin heatsinks.

Key words： power electronic devices liquid-cooled heatsink pin-fin structure heat transfer performance

Published: 10 November 2024 Online: 2024-11-11

CLC number:

TK172

Fund:National Key R & D Program of China (2021YFB3701902), the Beijing Municipal Science & Technology Commission's Project ( Z221100005822001), and Metal Powder Materials Proof-of-Concept Platform Project.

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	TIAN Xiaofei
	WNAG Linshan
	LIANG Xuebing
	ZHENG Fengshi
	HU Qiang

Cite this article:

TIAN Xiaofei,WNAG Linshan,LIANG Xuebing, et al. Research Progress of Liquid-Cooled Pin-Fin Heatsinks for Power Electronic Devices[J]. Materials Reports, 2024, 38(21): 23070138-11.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.23070138 OR http://www.mater-rep.com/EN/Y2024/V38/I21/23070138

1 Wu X L, Li C Y, Yang J L, et al. International Journal of Heat and Mass Transfer, 2023, 205, 123900.
2 Aranzabal I, Martinez de Alegria I, Garate J I, et al. In: 2017 11th IEEE International Conference on Compatibility. Cadiz, Spain, 2017, pp. 501.
3 Bhunia A, Chandrasekaran S, Chen C L. IEEE Transactions on Components and Packaging Technologies, 2007, 30, 309.
4 Valenzuela J, Jasinski T, Sheikh Z. Power Electronics Technology, 2005, 31, 50.
5 Pedersen K B, Pedersen K. In: 2012 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG). Aalborg, Denmark, 2012, pp. 519.
6 Gekenidis S, Ramezani E, Zeller H. In: 11th International Symposium on Power Semiconductor Devices and ICs. Toronto, Canada, 1999, pp. 129.
7 Ramminger S, Seliger N, Wachutka G. Microelectronics Reliability, 2000, 40, 1521.
8 Smet V, Forest F, Huselstein J J, et al. IEEE Transactions on Industrial Electronics, 2011, 58, 4931.
9 Liu Y. Modeling and simulation of microelectronic devices and packages, Science Press, 2010, 15 (in Chinese).
刘勇.微电子器件及封装的建模与仿真, 科学出版社, 2010, pp. 15.
10 Sohel Murshed S M, Nieto de Castro C A. Renewable and Sustainable Energy Reviews, 2017, 78, 821.
11 Zhang Z H, Wang X H, Yan Y Y. e-Prime - Advances in Electrical Engineering, Electronics and Energy, 2021, 1, 100009.
12 Sarvar F, Whalley D C, Low M K. J Electron Packag, 2001, 123, 338.
13 Cormier Y, Dupuis P, Farjam A, et al. International Journal of Heat and Mass Transfer, 2014, 75, 235.
14 Aranzabal I, Martinez de Alegria I,IEEE Transactions on Power Electro-nics, 2018, 34, 4185.
15 Gao W, Zhang J F, Qu Z G, et al. International Journal of Thermal Sciences, 2021, 164, 106902.
16 Sun X Q, Han Z W, Li X M. Applied Thermal Engineering, 2022, 207, 118142.
17 Zhao J, Du M S, Zhang Z, et al. International Journal of Heat and Mass Transfer, 2021, 181, 100009.
18 Blinov A, Vinnikov D, Lehtla T. Scientific Journal of Riga Technical University Power and Electrical Engineering, 2011, 29, 79.
19 Jiang K, Li T, Zhang Y L. Electronic Science and Technology, 2017, 30(2), 68 (in Chinese).
姜坤, 李涛, 张永亮.电子科技, 2017, 30(2), 68.
20 Tullius J F, Tullius T K, Bayazitoglu Y. International Journal of Heat and Mass Transfer, 2012, 55, 3921.
21 Qi W L, Zhao L, Wang W R, et al. Science Technology and Engineering, 2022, 22(11), 4261 (in Chinese).
齐文亮, 赵亮, 王婉人, 等. 科学技术与工程, 2022, 22(11), 4261.
22 Mertens R G, Chow L, Sundaram K B, et al. Journal of Electronic Pac-kaging, 2007, 129, 316.
23 Wen Y K, Kang Y H, Ruan L. In: 2020 IEEE 5th Information Technology and Mechatronics Engineering Conference. Chengqing, China, 2020, pp. 166.
24 Mohammadi A, Koşar A. Nanoscale and Microscale Thermophysical Engineering, 2018, 22, 153.
25 Al-damook A, Alkasmoul F S. Propulsion and Power Research, 2018, 7, 138.
26 Deng D X, Zeng L, Sun W. International Journal of Heat and Mass Transfer, 2021, 175, 121332.
27 Chu H Q, Yu X Y, Jiang H T, et al. International Journal of Heat and Mass Transfer, 2023, 200, 123530.
28 Gunnasegaran P, Mohammed H A, Shuaib N H, et al. International Communications in Heat and Mass Transfer, 2010, 37, 1078.
29 Wang H T, Chen Z H, Gao J G. Applied Thermal Engineering, 2016, 107, 870.
30 Kose H A, Yildizeli A, Cadirci S. Applied Thermal Engineering, 2022, 211, 118368.
31 Wang J, Yu K, Ye M Z, et al. Energy, 2022, 239, 122606.
32 Ye M Z, Du J Q, Wang J, et al. Energy, 2022, 260, 125000.
33 Wang Y B, Zhu K, Cui Z, et al. Applied Thermal Engineering, 2019, 151, 506.
34 Shahsavar A, Shahmohammadi M, Askari I B. International Communications in Heat and Mass Transfer, 2021, 127, 105500.
35 Hua J Y, Li G, Zhao X B, et al. Applied Thermal Engineering, 2016, 107, 768.
36 Zhao H X, Liu Z G, Zhang C W, et al. Experimental Thermal and Fluid Science, 2016, 71, 57.
37 Wan W, Deng D X, Huang Q S, et al. Applied Thermal Engineering, 2017, 114, 436.
38 Yang D W, Jin Z Y, Wang Y, et al. International Journal of Heat and Mass Transfer, 2017, 113, 366.
39 Yang D W, Wang Y, Ding G F, et al. Applied Thermal Engineering, 2017, 112, 1547.
40 Bhandari P, Padalia D, Ranakoti L, et al. Alexandria Engineering Journal, 2023, 69, 457.
41 Ambreen T, Kim M H. International Journal of Heat and Mass Transfer, 2018, 126, 245.
42 Ambreen T, Saleem A, Park C W. Applied Thermal Engineering, 2019, 158, 113781.
43 Ambreen T, Saleem A, Tanveer M, et al. Case Studies in Thermal Engineering, 2022, 31, 101806.
44 Bahiraei M, Heshmatian S, Goodarzi M, et al. Advanced Powder Techno-logy, 2019, 30, 2503.
45 Zeng L, Deng D X, Zhong N B, et al. International Journal of Mechanical Sciences, 2021, 200, 106445.
46 Qin L W, Zhang X Q, Hua J Y, et al. International Communications in Heat and Mass Transfer, 2022, 133, 105918.
47 Xu Y, Li L, Wang J L. International Journal of Heat and Mass Transfer, 2023, 209, 124079.
48 Yan Y F, Zhao T, He Z Q, et al. Chemical Engineering and Processing-Process Intensification, 2021, 160, 108273.
49 Hosseinirad E, Khoshvaght-Aliabadi M, Hormozi F. International Journal of Heat and Mass Transfer, 2019, 143, 118586.
50 Wang D, Hai T. Engineering Analysis with Boundary Elements, 2023, 146, 216.
51 Ji C, Liu Z G, Lv M M. Chemical Engineering and Processing-Process Intensification, 2022, 179, 109058.
52 Babar H, Wu H W, Ali H M, et al. Thermal Science and Engineering Progress, 2023, 37, 101616.
53 Rostami S, Nadooshan A A, Raisi A, et al. Journal of the Taiwan Institute of Chemical Engineers, 2023, 148, 104811.
54 Feng S, Yan Y F, Li H J, et al. Applied Thermal Engineering, 2019, 153, 748.
55 Zhao J, Huang S B, Gong L, et al. Applied Thermal Engineering, 2016, 93, 1347.
56 Yan Y F, Xue Z G, Xu F L, et al. Applied Thermal Engineering, 2022, 202, 117836.
57 Yan Y F, Wang D D, Xu F L, et al. International Journal of Heat and Mass Transfer, 2022, 186, 122518.
58 Karami M, Tashakor S, Afsari A, et al. Thermal Science and Engineering Progress, 2019, 14, 100417.
59 Jia Y T, Xia G D, Li Y F, et al. International Communications in Heat and Mass Transfer, 2018, 92, 78.
60 Chamanroy Z, Khoshvaght-Aliabadi M. International Journal of Thermal Sciences, 2019, 146, 106071.
61 Mohit M K, Gupta R. Case Studies in Thermal Engineering, 2022, 32, 101884.
62 Lee J, Ki S, Seo D, et al. Applied Thermal Engineering, 2020, 173, 115230.
63 Li Y T, Gong L, Xu M H, et al. International Journal of Heat and Mass Transfer, 2020, 151, 119376.
64 Li Y T, Gong L, Xu M H, et al. Applied Thermal Engineering, 2020, 166, 114665.
65 Zhou W N, Dong K J, Sun Q, et al. International Journal of Energy Research, 2022, 46, 11574.
66 Khattak Z, Ali H M. International Journal of Heat and Mass Transfer, 2019, 130, 141.
67 Chen M G. Fluid Measurement & Contro. 2021, 2(5), 39 (in Chinese).
陈名刚. 流体测量与控制, 2021, 2(5), 39.
68 Han F L. Powder Metallurgy Industey, 2011, 21(1), 1 (in Chinese).
韩凤麟.粉末冶金工业, 2011, 21(1), 1.