导电(Cu,Mn)<sub>3</sub>O<sub>4</sub>接触层在SOEC阳极侧的应用

doi:10.11896/cldb.23040278

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Abstract In SOEC stack, several issues including high contact resistance, oxidation of interconnect surface as well as anode‘ Cr poisoning’ exist between the interconnect and anode, which can significantly result in performance degradation for the stack. In this study, the (Cu, Mn)₃O₄-based spinel was evaluated as the SOEC anode-side contact material. A mixture of Mn and CuO was thermally converted into the spinel layer to lower the sintering temperature and enhance the performance. A simulated interconnect/contact/anode cell was fabricated to investigate the effectiveness of the reactively-sintered contact layer on the electrical performance and chemical compatibility. The tested cell exhibited extremely stable behavior with an ASR of only 20.13—20.32 mΩ·cm². While the Cr-rich oxide scale was effectively reduced, no obvious interdiffusion was observed between the contact layer and adjacent cell component at each interface. The (Cu, Mn)₃O₄ contact layer improved the electrochemical performance of the test cell, significantly reduced the contact resistance.

Key words： solid oxide electrolysis cell anode-side contact layer (Cu,Mn)₃O₄ spinel reactive sintering area-specific resistance (ASR)

Published: 25 April 2024 Online: 2024-04-28

CLC number:

TK91

Fund:Technology Project of China Southern Power Grid Co., Ltd. (GZHKJXM20190109), the Transformational Technologies for Clean Energy and Demonstration Strategic Priority Research Program of the Chinese Academy of Sciences (XDA210000), and the Youth Innovation Promotion of the Chinese Academy of Science (E129051031).

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	Articles by authors
	HUANG Xurui
	YU Yutian
	LEI Jinyong
	HAO Jingxuan
	YU Chuanxin
	PAN Jun
	YANG Yiping
	LIAO Zihao
	GUAN Chengzhi
	WANG Jianqiang

Cite this article:

HUANG Xurui,YU Yutian,LEI Jinyong, et al. Application of Electrically-conductive (Cu, Mn)₃O₄ Contact Layer on Anode-Side of SOEC[J]. Materials Reports, 2024, 38(8): 23040278-4.

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https://www.mater-rep.com/EN/10.11896/cldb.23040278 OR https://www.mater-rep.com/EN/Y2024/V38/I8/23040278

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