“后摩尔时代”芯片互连方法简析

doi:10.11896/cldb.22040268

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Abstract With the semiconductor process approaching its physical limit, the semiconductor industry has gradually entered the ‘More than Moore era'. Integrated technology is an important way to continue to improve the performance of electronic products. The key technologies to achieve high integration all require smaller size connections. With the decrease of connection size, the failure of devices at service temperature is beco-ming more and more serious due to the influence of the connection process on the package. Interconnection is an important way of chip heat conduction. Micro nano connection technology with high thermal conductivity and low process impact is expected to solve the reliability problem of high-power density devices. This paper summarizes the development of micro nano connection technology in new solders and energy transfer methods, briefly introduces the surface activation technology and discusses the possibility of its application in electronic packaging, and on this basis, briefly discusses the development direction of micro nano connection technology.

Key words： micro nano connection surface actived bonding low temperature solder nano solder electron beam irradiation ultrasonic connection

Published: 10 August 2023 Online: 2023-08-07

CLC number:

TG4

Fund:Opening Fund of Key Laboratory of Science and Technology on Silicon Devices, Chinese Academy of Sciences (KLSDTJJ2022-5),the National Key Research and Development Program of China (2020YFE0205300),Natural Science Foundation of Chongqing, China (cstc2021jcyj-msxmX1002), the Fundamental Research Funds for the Central Universities (AUGA5710051221), and Heilongjiang Provincial Natural Science Foundation of China (YQ2022E024).

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	Articles by authors
	ZHANG Shuye
	CHU Yuanfan
	LI Zhenfeng
	BAO Junhui
	ZHANG Yuyang
	LIU Yifu
	YI Qinghong
	CUI Lanxin
	HE Peng

Cite this article:

ZHANG Shuye,CHU Yuanfan,LI Zhenfeng, et al. A Brief Introduction of the ‘More than Moore Era' Chip Interconnection Method[J]. Materials Reports, 2023, 37(15): 22040268-10.

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http://www.mater-rep.com/EN/10.11896/cldb.22040268 OR http://www.mater-rep.com/EN/Y2023/V37/I15/22040268

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