锡锌系无铅钎料合金化研究进展

doi:10.11896/cldb.20010038

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Abstract Owing to the merits of similar eutectic melting point to the traditional Sn-Pb solders, compatibility with existing technology, and low cost etc., the Sn-Zn lead-free solders have been considered as one of the most promising alternatives for the conventional Sn-Pb solders. However, the Sn-Zn lead-free solder has problems such as poor wettability, oxidation resistance and corrosion resistance, which limit its practical engineering application. Studies have shown that alloying is an effective way to improve the performance of Sn-Zn lead-free solders.
In order to improve the wettability, oxidation resistance, corrosion resistance, mechanical properties and creep resistance of Sn-Zn solder, researchers have proposed different methods and solutions. Addressing the problem of poor wettability of Sn-Zn solders, alloying methods are mainly used to reduce its surface tension and suppress the formation of Cu-Sn intermetallic compounds at the interface. To improve the oxidation resistance of Sn-Zn solders, on the one hand, elements more active than Zn can be added to react preferentially with O₂ and then form a dense oxide protective film; on the other hand, a certain amount of alloying element can be added to the solder to form oxidation resistant phases with Sn or Zn. In addition, the passivation effect of corrosion products, the morphology of Zn-rich phase and the corrosion diffusion behavior of Zn-rich phase can be optimized by alloying method, so as to enhance the corrosion resistance of Sn-Zn solder. The mechanical properties of Sn-Zn solders are mainly improved by means of fine grain strengthening, second phase strengthening and solid solution strengthening, while the creep resistance of solders can be improved by adding a certain amount of Ni, Sb, RE and other elements.
This paper summarized the latest research progress in the alloying of Sn-Zn lead-free solders systematically. Furthermore, the difficulties and challenges about the studies on Sn-Zn lead-free solders were analyzed, and its future development prospects were prospected. The purpose of this paper is to provide some references for the preparation of high-performance Sn-Zn lead-free solders.

Key words： Sn-Zn lead-free solder alloying microstructure property

Published: 10 July 2022 Online: 2022-07-12

CLC number:

TG425+.1

Fund:Rare and Precious Metal Materials Genome Engineering Project of Yunnan Province (2018ZE007, 2019ZE001-3, 202002AB080001), and the Young and Middle-aged Academic and Technical Leaders Reserve Talent Project of Yunnan Province (202005AC160039).

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	LI Fang
	LI Caiju
	PENG Jubo
	YI Jianhong
	GAO Peng
	ZHANG Jiatao
	GUAN Hongda
	GUAN Yifan

Cite this article:

LI Fang,LI Caiju,PENG Jubo, et al. Research Progress on the Alloying of Sn-Zn Lead-free Solder[J]. Materials Reports, 2022, 36(13): 20010038-10.

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http://www.mater-rep.com/EN/10.11896/cldb.20010038 OR http://www.mater-rep.com/EN/Y2022/V36/I13/20010038

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