METALS AND METAL MATRIX COMPOSITES |
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Effect of Ultrasonic Vibration on Microstructure and Mechanical Properties of Welding-brazing Joint Between Aluminum and Copper by Plasma Welding |
FAN Ding1,2, LI Yongpeng2, WU Lijian2, HUANG Jiankang1,2, LIU Shien2, LIU Yulong2
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1 State Key Laboratory for Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China; 2 School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou 730050, China |
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Abstract Using an ultrasonic vibration assisted plasma arc welding method,an aluminum plate is joined to a red copper plate,the good weld formation was obtained through adjusting the welding parameters. The effects of ultrasonic vibration on Weld forming, grain size, joint interface structure and mechanical property were studied using SEM, EDS, XRD and universal tensile testing machine. When no ultrasonic vibration assistance, an intermetallic compound layer with a thickness of 55 μm is formed at the interface, some dendrites and large crystals appear in the Al-Cu eutectic region, and the shearing strength of the welded joint is 51.37 MPa. After the application of ultrasonic vibration assistance,the wetting ability of aluminum on the copper substrate increases, the thickness of the intermetallic compound layer decreases to 29 μm, the grain size of the Al-Cu eutectic zone decreases significantly, and the shearing strength of the welded joint increases to 84.93 MPa. The fracture form of the joint is brittle fracture.
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Published: 07 September 2021
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Fund:National Natural Science Foundation of China (51465031), Postgraduate Research Project of Lanzhou University of Technology. |
About author:: Ding Fan, professor, doctoral tutor, enjoys special allowances from the State Council, member of the International Welding Society IIW-IX-H Committee, executive director of the China Welding Society. Mainly engaged in research on welding physics, welding methods and intelligent control, and laser processing, published more than 300 papers. |
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