导热吸波材料的研究进展及未来发展方向

doi:10.11896/cldb.20020002

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Abstract Microwave absorbing materials can effectively solve the electromagnetic compatibility of electronic equipment while thermal conductive mate-rials are the key to heat dissipation of electronic devices. As the power density of electronic devices has increased, significant time has been spent researching the functional integration of microwave absorbing materials and thermal conductive materials, in order to improve the electromagnetic compatibility and heat dissipation of electronic devices. Most studies improved the thermal conductivity and microwave absorbing performance of the materials by simultaneously adding a traditional thermal conductive filler and microwave absorbing agent into the matrix. However, due to the limit on the total amount of functional fillers in polymer materials, adding one of the functional fillers (thermal conduction or microwave absorption) will inevitably reduce the content of the other functional filler, which can hardly achieve the collaborative improvement of two properties. At present, there is no effective method to solve this problem; thermal conduction and microwave absorption performance can only be balanced by coordinating the two functional filler proportions.
There are many factors influencing the thermal conductivity and microwave absorption performance of materials, with the different factors often interacting with one another. To reduce the complexity of the issue, the influence of various factors on material performance (such as particle size, structural parameters and process parameters) have been comprehensively analyzed, by studying the relations between the doping filler components. Finally the regulation mechanism and method can be obtained, which have a high guidance value for practical application. After more than ten years of development, researchers have made great progress in developing the preparation technology of thermal microwave absorbing materials. However, some technical bottlenecks still remain, hinding any further development of the industry. For example, the lack of a material microstructure and functional unit model, the disconnection between theory and industrial production applications, and the dearth of a guide on the use of multi-functional fillers seriously restrict innovation in basic design theory on thermal microwave absorbing materials. Moreover, there are some deficiencies with the industrial production process. Currently, large differences exist in the evaluation indexes, test principles, test methods and test standards between the thermal conductivity and microwave absorption of the industry products. A large disparity in test data between the two product types has led to a lack of uniform standards, which restricts the promotion and application of the products.
In this paper, we summarize the research history and the latest research progress of thermal microwave absorbing materials, analyzing their current problems in the research of thermal microwave absorbing materials, and looking forward to the direction of future research and development. The purpose of this paper is to provide a reference for the preparation of high-performance thermal microwave absorbing materials, enhancing the technical level of the industry to improve upon product performance.

Key words： thermal microwave absorbing materials thermal conductivity microwave absorbing property

Published: 31 May 2021

CLC number:	TN972
	TM25

Fund:National Natural Science Foundation of China (U1710115), Natural Science Foundation of Shanxi Province, China (201701D121050), Youth Natural Science Foundation of Shanxi Province, China(201901D211576).

About author:: Kun Jia received his M.S. degree in material from Southwest University in 2015. He is currently working at Electromagnetic Protection Materials and Technology Key Laboratory of Shanxi Province. His research has focused on preparation technology of carbon nano electromagnetic protection materials.
Wei Liu received his M.S. degrees in June 2017 from Chinese Academy of Sciences. He is currently an engineer of 33rd Institute of China Electronics Technology Group Corporation, focusing on the research of carbon-based electromagnetic protection materials.

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Cite this article:

JIA Kun,WANG Zhe,WANG Peng, et al. Progress and Future Developments of Thermal Microwave Absorbing Materials[J]. Materials Reports, 2021, 35(9): 9133-9139.

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http://www.mater-rep.com/EN/10.11896/cldb.20020002 OR http://www.mater-rep.com/EN/Y2021/V35/I9/9133

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