Cu中间层对GH4099与Mo-Cu合金HIP扩散焊接头的影响

doi:10.11896/cldb.20010155

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Abstract Mo-Cu alloy, as a new type of superalloy material, not only has the properties of high-melting-point, low expansion coefficient, but also has the properties of high ductility, high electric conduction and thermal conductivity. It can be applied to lots of fields such as aerospace, nuclear industry, electronics, etc. There’s a burning problem to be solved that how to connect Mo-Cu alloy with GH4099 superalloy which is resis-tant to high temperature and oxidation, to make composite components, so as to avoid the poor high temperature oxidation resistance of Mo alloy, and the disadvantage of low temperature brittleness. As it can be widely used as high temperature structural material. In general, traditional wel-ding is difficult to achieve effective bonding of refractory alloy. HIP can avoid recrystallization in the welding area, what’s more, the large area connection can be realized for materials sensitive to deformation rate. For this reason, the quality of GH4099/Mo-Cu HIP diffusion bonding joints are compared and analyzed by using different thickness of Cu interlayer in this paper. Preparation of Cu interlayer by PVD, the diffusion couples are connected under the proper welding parameters. The interface element migration, diffusion layer evolution and fracture morphology which with different thickness of Cu interlayer were characterized by SEM-EDS, and the mechanical properties of the joint were tested by hardness, tensile and shear tests. The results show that Cu interlayer is beneficial to the connection of diffusion bonding, the PVD coating is better than the foil as the interlayer.

Key words： interlayer diffusion bonding HIP PVD

Published: 28 January 2021

CLC number:

TG453

Fund:The National Natural Science Foundation of China (51675255, 51761027).

About author:: Tiejun Wang,a well-known expert in the powder me-tallurgy field with rich experience and remarkable achievements, Ph.D., professor of senior engineer, currently is the VP of advanced technology and mate-rials, Ltd.(AT&M), The editorial committee member of Powder Metallurgy Technology and Powder Metallurgy Industry, the member of AT&M Technical Innovation Committee. Engaged in the research, development, application, promotion and industrialization of refractory metal materials, metal-ceramic composites and hot isostatic pressing (HIP) technology for many years. Commended as the “Beijing science and technology new star” in 2004. Hosted 10 and participated in 15 national enterprise technological innovation projects. Won twice the second prize of the Science and Technology of China Nonferrous Metals Industry Award, three times the third prize of Metallurgy Science and Technology Award, once the third prize of Beijing Science and Technology Award, once the second prize of Hebei Province Metallurgy Science and Technology Award, and once the third prize of China Nuclear Energy Industry Science and Technology Award. 33 patents authorized. Awarded as the “Outstanding Young Expert of Central Enterprises”, the “Outstanding Communist Party Member of Central Enterprise”, the “Outstanding Manager” of CISRI, and the “Model Worker” of CISRI.
Longge Zhang,born in November 1992, majored in material science and engineering at Central Iron & Steel Research Institute. He has mainly focused on the research of the hot isostatic pressing diffusion bonding technology. From may 2018 to now, he educated and learned at the Engineering and Technology Research Center of Hot Isostatic Pressing.
Hongyan Che, Ph.D., professor of senior engineer in hot isostatic pressing field with rich experience and remarkable achievements, currently is the general mana-ger of PM devision of Advanced Technology and Mate-rials, Ltd(AT&M). The member of AT&M Technical Innovation Committee. Engaged in the research, deve-lopment, application, promotion and industrialization of hot isostatic pressing (HIP) technology for many years. Hosted 6 and participated in 3 national enterprise technological innovation projects. Won the third prize of China Nuclear Energy Industry Science and Technology Award. And the first prize of Baoding Science and Technology Progress Award. All rank first. 5 patents authorized, more than 40 papers published. Awarded as “An Advanced Individual for Meritorious Service by Women” of CISRI, “Innovative Talents” of Hebei Province.

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	WANG Tiejun
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	WANG Xueyuan

Cite this article:

WANG Tiejun,ZHANG Longge,CHE Hongyan, et al. Effect of Cu Interlayer on GH4099 and Mo-Cu Joint of HIP Diffusion Bonding[J]. Materials Reports, 2021, 35(2): 2098-2102.

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http://www.mater-rep.com/EN/10.11896/cldb.20010155 OR http://www.mater-rep.com/EN/Y2021/V35/I2/2098

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