固化剂对树脂基Sn-58Bi复合焊膏铺展性能的影响

doi:10.11896/cldb.19060118

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Abstract The commercially available Sn-58Bi solder paste was taken as a research object and E51 type epoxy resin was added, the Sn-58Bi resin-based solder paste with different curing agents were prepared. The wettability of different kinds of solder pastes were compared. The DSC and FT-IR analysis were used to explore the activity of curing agents and the functional groups of curing products. The results showed that the solder paste with m-phenylenediamine as curing agent has been cured within 4 h at room temperature. The anti-wetting and non-wetting pheno-menon occurred in the spreading process when no curing agent or 593 curing agent, 651 curing agent, methyltetrahydrophthalic anhydride curing agent was used as curing agent of solder paste, while triethanolamine and DMP-30 can keep and promote the wettability of solder paste. Among them, the addition of triethanolamine curing agent increased the spreading area of solder paste by 17.66% on the basis of good curing and for-ming morphology. DSC test results showed that the high-active curing agent in the solder paste caused none wetting phenomenon. FT-IR analysis showed that the amine and carboxylic acid containing in the paste as well as the addition type curing agent will be consumed by the curing reaction, which reduced the flux activity and caused anti-wetting phenomenon. Tertiary amines can act as active agents and will not be consumed by the curing reaction, thus inhibiting anti-wetting and improving wettability.

Key words： Sn-58Bi resin-based solder paste spreading property curing agent

Published: 02 December 2020

CLC number:

TG425.1

Fund:This work was financially supported by the National Natural Science Foundation of China (51675269) and the State Key Laboratory of Advanced Brazing Filler Metals ＆ Technology (SKLABFMT201704).

About author:: Songbai Xue, who enjoys special government allo-wances, is currently a level-2 professor and Ph. D. supervisor at the College of Material Science and Techno-logy in Nanjing University of Aeronautics and Astronautics (NUAA). He has focused on welding materials and technology for decades. During these years, he formulated 5 national standards and 5 professional stan-dards of Ministry of Machinery Industry. Besides, he earned more than thirty major research achievements, including a second prize of 2016 State Science and Technology Progress Award, a second prize of 2014 technical invention award of the Ministry of E-ducation, a third prize of National Defense Science and Technology Progress Award, et al.He has published about 320 papers in journals, including 120 papers indexed by SCI and 160 papers indexed by EI. The total citations are no less than 800 while a single paper is cited 118 times.Siyi Liureceived his M. S. degree in April, 2020 from Nanjing University of Aeronautics and Astronautics (NUAA). He is currently working at Nanjing Guobo Electronic Co.,Ltd., which working on the research of microelectronic assembly and packaging for electronic devices

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	XUE Songbai
	LIU Siyi
	LIU Lu
	ZHONG Sujuan
	LONG Weimin

Cite this article:

XUE Songbai,LIU Siyi,LIU Lu, et al. Effect of Curing Agent on the Spreading Property of Sn-58Bi Resin-based Solder Paste[J]. Materials Reports, 2020, 34(22): 22172-22177.

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http://www.mater-rep.com/EN/10.11896/cldb.19060118 OR http://www.mater-rep.com/EN/Y2020/V34/I22/22172

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