面向机械装备健康监测的振动传感器研究现状

doi:10.11896/cldb.19070076

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Abstract The safe operation of large mechanical equipment is related to the healthy development of national economy, so it is particularly important to evaluate the performance and monitor the health of mechanical equipment to ensure its safe and efficient operation. Vibration parameters, such as stress, strain, velocity, acceleration and displacement, are important indexes for evaluating the operating state of mechanical equipment. They can not only reflect the operating state of equipment in real time but also predict the service life of equipment. Therefore, collecting necessary structural vibration information becomes an important link in the health monitoring of mechanical equipment.
Vibration information collection mainly relies on a variety of vibration sensors. Acceleration sensors and strain sensors are commonly used in mechanical structure health monitoring. As tools for diagnosing structural damage of mechanical equipment, they can accurately collect vibration signals during the operation of mechanical equipment. At present, the research of vibration sensor mainly focuses on the development of mate-rials, the optimization of sensor performance, the introduction of new technology and so on. Lead-free ceramics respond to the ecological needs of the country and have excellent characteristics such as good high temperature. Flexible piezoelectric composite materials make the sensor lightweight and broaden the application range of piezoelectric sensors. The optimization of sensor performance can be achieved by means of sensor circuit design and sensor structure optimization. In addition, the cutting mode of piezoelectric crystals and the presence of parasitic capacitance also affect the sensitivity of piezoelectric acceleration sensor and capacitive acceleration sensor respectively. With the development of printing technology, electronic components are easily embedded into the flexible matrix, reducing the production cost of strain gauge. Fiber Bragg grating strain sensor is playing an important role in the health monitoring of mechanical structure because of its good anti-electromagnetic interference and anti-corrosion advantages. In addition, self-powered technology, RFID and other new technologies used in vibration sensor,which achieves passive, low-cost and non-contact measurement.
This paper reviews the mechanical structure commonly used in health monitoring of the characteristics and applications of the acceleration sensor and strain sensor, illustrates the development status of piezoelectric acceleration sensor, the capacitive accelerometer, the resistive sensor and the fiber Bragg grating strain sensor, also discusses the research progress of new type of passive sensors such as self-supply vibration sensors, RFID sensor etc., discusses the development trend and application prospects of vibration sensor, which can provide a variety of industries of machinery and equipment health monitoring theory and technical guidance.

Key words： equipment health monitoring vibration sensor acceleration sensor strain sensor fiber grating sensor

Published: 24 June 2020

CLC number:

TP212.9

Fund:National Natural Science Foundation of China (NSFC) (51535011, 51775554)

About author:: Yongfang Zhangis an associate professor and postgraduate tutor at the Faculty of Printing, Packaging Engineering and Digital Media Technology. She received her B.E. degree in mechanical and electrical enginee-ring from Gansu University of Technology in 1998 and received her Ph.D. degree in the school of Electronics and Information from Northwestern Polytechnical University in 2007. In recent years, she has presided over more than 20 scientific research projects, such as national natural science foundation of China, shaanxi natural science foundation and state key laboratory open project. Published more than 40 papers, including more than 30 SCI and EI retrieval papers.
Zhiguo Xingis an assistant researcher of the state key laboratory of remanufacturing. Mainly engaged in tribo-logy and remanufacturing life evaluation direction of teaching and scientific research, master tutor. He has presided over 2 natural fund projects, Beijing fund projects and Tsinghua University tribology laboratory fund key projects. He has participated in more than 10 projects, including the National 973 Project, the National Defense 973 Project, the Basic Strengthening Project of the Science and Technology Commission, the Outstanding Youth Fund, the Key Project of the Natural Fund, and the Major Project of Beijing. Deputy director of youth friction working committee, tribology branch, Chinese society of mechanical engineering. Author of the chapter entry of green manufacturing in the third edition of mechanical engineering volume of China encyclopedia. Members of the ministry of education’s 10 000 science puzzle preparation team. He is also the reviewer of three international and domestic SCI and EI retrieval journals.

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	张永芳
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Cite this article:

张永芳,王霞,邢志国, et al. Research on Vibration Sensors for Health Monitoring of Mechanical Equipment[J]. Materials Reports, 2020, 34(13): 13121-13130.

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http://www.mater-rep.com/EN/10.11896/cldb.19070076 OR http://www.mater-rep.com/EN/Y2020/V34/I13/13121

1 Zeng Y J,Jin X H, He Y Q, et al. Railway Locomotive & Car, 2019,39(2),104(in Chinese).
曾燕军,金希红,何永强,等. 铁道机车车辆, 2019,39(2),104.
2 Gatti M. Engineering Structures,2019,195,200.
3 Zhao J, Jia J, Wang H,et al. IEEE Sensors Journal, 2007, 7(8),1102.
4 Popova I, Lestev A, Semenov A, et al. IEEE Aerospace & Electronic Systems Magazine, 2009, 24(5),33.
5 Zhang Z, Ji L, Huang Z, et al. Iet Signal Processing, 2011, 5(8),1.
6 Selim H, Girgis G A. IEEE Transactions on Industrial Electronics, 1986, 33(1),44.
7 Sabato A, Feng M, Fukuda Y, et al. IEEE Sensors Journal, 2016,16(9),2942.
8 Ziegler L, et al.Marine Structures, 2019,66,154.
9 Bharadwaj K, Sheidaei A, Afshar A, et al. Measurement, 2019,139, 326.
10 Casiraghi C, Macucci M, Parvez K, et al. Carbon, 2018, 129, 462.
11 Zhang H. Research on measurement technique for MEMS accelerometer and signal process circuit. Master’s Thesis, Soochow University, China, 2014(in Chinese).
张寒. MEMS加速度传感器及其调理电路测试技术研究,硕士学位论文,苏州大学,2014.
12 Reguieg S K, Ghemari Z, Benslimane T, et al. Sensing and Imaging: An International Journal, 2019, 20(1),1.
13 Ghemari Z. In: 2018 International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM).Algiers,2018,pp.29.
14 Liu Z, Cai C, Yu M, et al. In:2016 3rd International Conference on Information Science and Control Engineering (ICISCE). Beijing, 2016,pp.1.
15 Zhou H, Han R H, Xu M H, et al. In: 2016 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA). Xi’an,2016,pp.455.
16 Kong L F, Yu F P, Qin L F, et al. In: 2017 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), Chengdu,2017,pp.27.
17 Wu G D, Liu X L, Yu F P, et al. In: 2019 Symposium on Piezoelectrcity, Acoustic Waves and Device Applications (SPAWDA). Harbin, 2019,pp.1.
18 Denghua L, Xiangyu G, Feng Z, Ferroelectrics, 2010, 405(1), 126.
19 Wu J G, Gao X Y, Chen J G, et al. Acta Physica Sinica, 2018, 67(20),10(in Chinese).
吴金根,高翔宇,陈建国,等.物理学报, 2018, 67(20),10.
20 Kubasov, Ilya, et al. Sensors, 2019,19, 614.
21 Wang H S, Weng X Q, Xu J L, et al. China Ceramics, 2019, 55 (2),1(in Chinese).
王海圣,翁新全,许静玲,等.中国陶瓷,2019,55(2),1.
22 Schulze R, Gessner T, Heinrich M, et al. In: 21st IEEE International Symposium on Applications of Ferroelectrics. Aveiro, 2012,pp.1.
23 Long J, Songyuan M, Weili D, et al. Nano Energy, 2018,50,632.
24 Lu X, Qu H, Skorobogatiy M. Scientific Reports, 2017, 7(1),2907.
25 Yuan F. The design and manufacture of the tri-axis capactive accelerometer based on the single mass. Master’s Thesis, Soochow University,China,2015(in Chinese).
袁飞. 电容式单质量三轴加速度计的研制.硕士学位论文,苏州大学,2015.
26 Singh Panwar, B. Materials Today: Proceedings, 2018,5(7), 15481.
27 Burbaum C, Mohr J, Bley P, et al. Sensors & Actuators A Physical, 1991, 27(1-3),559.
28 Szaniawski K, Napieralski A, Sekalski P, et al. In: International Confe-rence on Microelectronics. Serbia, 2004,pp.371.
29 Chae J, Kulah H, Najafi K. Journal of Microelectromechanical Systems, 2005, 14(2), 235.
30 Tavakoli H, Momen H G, Sani E A. In: Electrical Engineering. Pakistan, 2017,pp.131.
31 Falconi C, Fratini M. Sensors and Actuators B: Chemical, 2008, 129(1),59.
32 Ko Hyoungho, Cho Dongil Dan. Sensors and Actuators: A Physical, 2010, 158(1), 72.
33 Liu G, Yang F, Bao X, et al. Sensors, 2015, 15(3),6342.
34 Zhou W, He J B, Yu H J, et al. Sensors and Actuators A: Physical, 2019,290,239.
35 Qu H, Peng B, Peng P, et al. Instrument Technique and Sensor, 2018(6),15(in Chinese).
曲昊,彭倍,彭鹏,等.仪表技术与传感器,2018(6),15.
36 Dong X, Huang Q W, Xu W, et al. Sensors and Actuators A: Physical, 2019, 285, 581.
37 Nawrot U, Geernaert T, Pauw B D, et al. In: 25th International Confe-rence on Optical Fiber Sensors. Korea, 2017,pp.1.
38 Zhou K, Wu Z Y. Engineering Structures,2017,141(15),184.
39 Zhang T X. Fiber accelerometer based on frequency modulation. Master's Thesis, Shandong Normal University,China,2015(in Chinese).
张童心.基于频率调制的光纤加速度计的研究.硕士学位论文,山东师范大学,2015.
40 Pecora A, Maiolo L, Minotti A, et al. In: 2014 IEEE Metrology for Ae-rospace. Benevento,2014,pp. 84.
41 Wang Yanlei, et al. Construction and Building Materials, 2018,186,367.
42 Quiros-Solano W F, Gaio N, Silvestri C, et al. In: 19th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers). Taiwan, China, 2017,pp. 1296.
43 Shakeel M, Khan W A, Rahman K. Sensors and Actuators A: Physical, 2017, 258,123.
44 Zhang Y, Anderson N, Bland S, et al. Sensors and Actuators A: Physical, 2017, 253, 165.
45 Bessonov A, Kirikova M, Haque S, et al. Sensors and Actuators A: Phy-sical, 2014, 206, 75.
46 Maddipatla D, Narakathu B B, Avuthu S G R, et al. In: 2015 IEEE Sensors.Busan,South Korea, 2015,pp. 1.
47 Maiwald M, Werner C, Zoellmer V, et al. Sensors and Actuators A: Physical, 2010, 162(2),198.
48 Wang X, Sparkman J, Gou J. Composites Communications, 2017, 3,1.
49 Enser H, Sell J K, Hilber W, et al. Sensors and Actuators A: Physical, 2018, 281,258.
50 Hoshizaki T, Yokayama K. Nature, 1965, 207(4999), 880
51 Wu B, Liu B, Zheng J, et al. Measurement, 2018, 122, 297.
52 Serafini J, Bernardini G, Porcelli R, et al. Aerospace Science and Technology, 2019,127,551.
53 Chen, S Z, Gang W, Feng D C. Mechanical Systems and Signal Proces-sing,2019,127,551.
54 Cheilakou E, Tsopelas N, Anastasopoulos A, et al. Procedia Structural Integrity,2018, 10,25.
55 Oh B K, Kim K J, Kim Y, et al. Applied Soft Computing,2017, 58,576.
56 Maiwald M, Werner C, Zoellmer V, et al. Sensors and Actuators A: Physical, 2010, 162(2), 198.
57 Sell J K, Enser H, Schatzl-Linder M, et al.In:2017 IEEE Sensors.UK,2017,pp.1.
58 Gräbner D, Dumstorff G, Lang W. Procedia Manufacturing, 2018, 24, 258.
59 Zhao H, Lin Z Q, Xiao K, et al. Electronic Design Engineering, 2014(19),10(in Chinese).
赵浩, 林宗强, 肖恺,等.电子设计工程, 2014(19),10.
60 Lv J L, Hu Z C, Ren G F, et al. Optik, 2019,178, 146.
61 Zhang J, Guo S L, Wu Z S, et al. Engineering Structures, 2015, 99, 173.
62 Tsushima N, Su W, Gutierrez H, et al. Aerospace Science and Technology, 2017,71,285.
63 Zhang Z, Liu C, Li H, et al. Photonic Sensors, 2017, 7(2),140.
64 Wang X, Guo Y, Xiong L. Chinese Optics Letters, 2018, 16(7), 070604.
65 Liu A C, Fan W J, Fan L L. In: 2018 Asia Communications and Photo-nics Conference (ACP).Hangzhou,2018,pp. 1.
66 Tian K, Liu Y, Wang Q. Optical Fiber Technology: Materials, Devices and Systems, 2005, 11(4),370.
67 Mondal S K, Tiwari U, Poddar G C, et al. Review of Scientific Instruments, 2009, 80(10),1442.
68 Guo G. Optik-International Journal for Light and Electron Optics,2019,182, 331.
69 Wada D, Igawa H, Murayama H. Measurement, 2016, 94,745.
70 Huang J, Zhou Z, Wen X, et al. Measurement, 2013, 46(3),1041.
71 Esposito, Flavio et al. Optics & Laser Technology,2019, 113,198.
72 Echevarria J, Quintela A, Jauregui C, et al. IEEE Photonics Technology Letters, 2001, 13(7),696.
73 James S W, Tatam R P, Twin A, et al. Measurement Science and Technology,2002,13(10),87.
74 Qiang H, Xingzhe W, Mingzhi G, et al. IEEE Transactions on Applied Superconductivity, 2019,29,1.
75 Li R Y, Tan Y G, Chen Y Y, et al. Optical Fiber Technology,2019,48,199.
76 Guo Y B, Zhang Z, Zhang S W. Friction, 2019, 7, 289.
77 Su Z, Wu H, Chen H, et al. Nano Energy, 2017, 42,129.
78 Zhao X J, Wei G W, Li X H, et al.Nano Energy, 2017,34,549.
79 Zhang Z X, He J, Wen T, et al. Nano Energy, 2017, 33,88.
80 Jiang C, Xie L Y, Xue S T. Structural Engineers, 2017,33(3),199(in Chinese).
蒋灿,谢丽宇,薛松涛.结构工程师,2017,33(3),199.
81 Cazeca M J, Mead J, Chen J, et al. Sensors and Actuators A: Physical, 2013, 190,197.
82 Chakaravarthi G, Prasath L K, Philip J, et al. IEEE Sensors Journal, 2018, 99,1.
83 Zhang J, Tian G Y, Zhao A B. NDT & E International,2017,86,89.