电子封装无铅软钎焊技术研究进展

doi:10.11896/cldb.18120017

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Abstract Soldering technology is widely used in the field of electronic packaging to enable interconnection between electronic packaging devices and materials. SnPb solder has been a commonly used brazing material in the field of electronic packaging due to its good wetting properties, solderability and suitable price. However, Pb is an element that causes harm to the human body and the environment. With the increasing awareness of environmental protection, the use of lead has been greatly restricted. The replacement of SnPb solder by lead-free solder is an inevitable trend in the development of solder, accelerating the lead-free process of soldering technology.
When brazing, the performance of the flux determines the efficiency and quality of the solder, so choosing the right flux is key. At present, domestic and foreign research scholars have done a lot of research on lead-free soldering, and have achieved rich results, such as the development of a variety of new lead-free solder by alloying, particle strengthening and other methods; the United States, Japan and Europe have released development guide for lead-free solder and lead-free soldering; development of a variety of lead-free no-clean fluxes. Therefore, basic research and application development systems based on soldering technology have matured. There are three widely used soldering techniques, including wave soldering, reflow soldering, and semiconductor laser soldering.Wave soldering is generally used in hybrid assembly, and reflow soldering is mainly used in surface mount. Semiconductor laser welding as a group welding process is often applied to soldering electronic components and assembly of chip components on a printed circuit board. With the gradual development of electronic products in the direction of miniaturization and multi-functionality, the requirements for connection reliability are getting higher and higher, but the research and application development based on sol-dering technology is still insufficient.
In this paper, the research progress and development direction of soldering technology are discussed for the lead-free soldering technology of selectronic packaging. First, introduce the types and composition of lead-free solders and fluxes. Then, for the problem of the interface reaction between Sn and Cu brought by lead-free, three kinds of solutions for substrate alloying, annealing treatment and electroless plating are proposed through Cu substrate. Finally, the reflow, wave soldering and semiconductor laser welding and their applications are elaborated, which provides a further theoretical basis for the study of lead-free soldering technology for electronic packaging.

Key words： electronic packaging particle strengthening microalloying lead-free soldering flux

Published: 30 September 2019

CLC number:

TG425

Fund:This work was financially supported by the National Natural Science Foundation of China(51475220), Postdoctoral Science Foundation of China(2016M591464), Six Talent Peaks of Jiangsu Province (XCL-022), Young and Middle-aged Academic Leaders Program in Blue Project of Jiangsu Province, Key Project of State Key Laboratory of Advanced Welding and Joining (AWJ-19Z04), Postgraduate Research & Practice Innovation Program of Jiangsu Normal University (2019XKT161).

About author:: Nan Jiang received his bachelor’s degree in enginee-ring from Jiangsu Normal University KeWen College in 2018. He is currently pursuing his master’s degree at school of Mechatronic Engineering, Jiangsu Normal University under the supervision of Prof. Liang Zhang. His research has focused on microelectronic packaging materials and technology.
Liang Zhang received a bachelor’s degree in material forming and control engineering at Nanchang Aeronautical University in July 2006 and received his doctor’s degree in material processing engineering at Nanjing University of Aeronautics and Astronautics in 2011, as a public visiting scholar, visited the University of California at Los Angeles Electronic Thin Film Laboratory for research from April 2013 to July 2014, he is currently a full professor in Jiangsu Normal University. His research involved the field of electronic packaging technology, 3D packaging chip stacking, lead-free solder and interconnect technology, solder joint reliability, brazing materials and technology.

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	JIANG Nan
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Cite this article:

JIANG Nan,ZHANG Liang,XIONG Mingyue, et al. Research Progress on Lead-free Soldering Technology for Electronic Packaging[J]. Materials Reports, 2019, 33(23): 3862-3875.

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http://www.mater-rep.com/EN/10.11896/cldb.18120017 OR http://www.mater-rep.com/EN/Y2019/V33/I23/3862

Sun F L, Peng L J. Journal of Harbin University of Science and Technology,2018(3),56(in Chinese). 孙凤莲,彭丽娟.哈尔滨理工大学学报,2018(3),56.2 Sun L, Chen M H, Zhang L, et al. Acta Metallurgica Sinica,2017,53(5),105(in Chinese).孙磊,陈明和,张亮,等.金属学报,2017,53(5),105.3 Xue P, Wang K H, Zhou Q, et al. Transactions of the China Welding Institution,2016,37(1),33(in Chinese).薛鹏,王克鸿,周琦,等.焊接学报,2016,37(1),33.4 Sun P. Interface evolution and reliability of lead-free solder joints in electronic packaging. Doctor’s Thesis, Shanghai University, China,2007(in Chinese).孙鹏.电子封装中无铅焊点的界面演化和可靠性研究.博士学位论文,上海大学,2007.5 Hu Z T, Xu D R. Electronic Process Technology,2005,26(3),125(in Chinese).胡志田,徐道荣.电子工艺技术,2005,26(3),125.6 Yan X W, Qiu T, Zhang Z Z. Electronic Components and Materials,2006,25(3),5(in Chinese).颜秀文,丘泰,张振忠.电子元件与材料,2006,25(3),5.7 Wang L, Yu D Q, Zhao J, et al. Materials Letters,2002,56(6),1039.8 Yang B, Chen J M, Wu S J, et al. Materials Review B: Research Papers,2017,31(7),92(in Chinese).杨斌,陈剑明,邬善江,等.材料导报:研究篇,2017,31(7),92.9 Dong C H, Wang F J, Ding H J, et al. Hot Working Technology,2015(1),190(in Chinese).董昌慧,王凤江,丁海健,等.热加工工艺,2015(1),190.10 Suganuma C. Foundation of lead-free soldering technology, Science Press, China,2017(in Chinese).菅沼克昭.无铅软钎焊技术基础,科学出版社,2017.11 Zhang L, Sun L, Guo Y H, et al. Application of Electronic Technology,2015,41(1),12(in Chinese).张亮,孙磊,郭永环,等.电子技术应用,2015,41(1),12.12 Zhang L, Tu K N, Sun L, et al. Transactions of the China Welding Institution,2015,36(1),59(in Chinese).张亮,Tu King Ning,孙磊,等.焊接学报,2015,36(1),59.13 Gao S T, Yang K W. Electronics & Packaging,2004,4(1),10(in Chinese).高尚通,杨克武.电子与封装,2004,4(1),10.14 Sun L, Zhang L. Electronic Process Technology,2015,36(1),4(in Chinese).孙磊,张亮.电子工艺技术,2015,36(1),4.15 Liu X, Zhao Y, Huang M, et al. In: International Conference on Electronic Packaging Technology & High Density Packaging. IEEE,2013,pp.687.16 Zhang L, Han J G, He C W, et al. Journal of Materials Engineering,2014,3(10),55(in Chinese).张亮,韩继光,何成文,等.材料工程,2014,3(10),55.17 Ke C B, Zhou M B, Zhang X P. Acta Metallurgica Sinica,2014,50(3),294(in Chinese).柯常波,周敏波,张新平.金属学报,2014,50(3),294.18 Gain A K, Fouzder T, Chan Y C, et al. Journal of Alloys & Compounds,2010,506(1),216.19 Yang L M. Journal of Electronic Materials,2013,42(12),3552.20 Zhang L, Gao L L. Journal of Alloys & Compounds,2015,635,55.21 Tsao L C, Chang S Y. Materials & Design,2010,31(2),990.22 Liu J, Andersson C, Gao Y, et al. In: Electronics Packaging Technology Conference, Eptc 2008. IEEE, Singapore,2008,pp.84.23 Yang M, Han B B, Ma X, et al. Electronics Process Technology,2014,35(1),1(in Chinese).杨明,韩蓓蓓,马鑫,等.电子工艺技术,2014,35(1),1.24 Cui Q, Gao F, Mukherjee S, et al. Small,2010,5(11),1246.25 Chee S S, Lee J H. Electronic Materials Letters,2012,8(6),587.26 Dai J, Li H Y, Liu Z, et al. Hot Working Technology,2017,46(9),52(in Chinese).戴军,李华英,刘政,等.热加工工艺,2017,46(9),52.27 Wang F J, Gao F, Ma X, et al. Journal of Electronic Materials,2006,35(10),1818.28 Yang F, Zhang L, Liu Z Q, et al. Electronic Components and Materials,2016,35(12),1(in Chinese).杨帆,张亮,刘志权,等.电子元件与材料,2016,35(12),1.29 Zhang L, Tu K N, Guo Y H, et al. Chinese Journal of Rare Metals,2015,39(1),11(in Chinese).张亮,Tu King Ning,郭永环,等.稀有金属,2015,39(1),11.30 Xiong L Y, Xue S B, Wang H. Welding & Joining,2017(12),9(in Chinese).熊丽媛,薛松柏,王禾.焊接,2017(12),9.31 Chen Z G. Research on creep behavior of SnAgCuRE brazed joints. Doctor’s Thesis, Beijing University of Technology, China,2003(in Chinese).陈志刚.SnAgCuRE钎焊接头蠕变行为的研究.博士学位论文,北京工业大学,2003.32 Gao L L. Effects of rare earth Pr and Nd on microstructure and properties of SnAgCu lead-free solder. Doctor’s Thesis, Nanjing University of Aeronautics and Astronautics, China,2012(in Chinese).皋利利.稀土Pr和Nd对SnAgCu无铅钎料组织与性能影响研究.博士学位论文,南京航空航天大学,2012.33 Zhang L, Fan X Y, Guo Y H, et al. Materials & Design,2014,57(5),646.34 Luo D X, Xue P, Xue S B, et al. Transactions of the China Welding Institution,2013,34(6),57(in Chinese).罗冬雪,薛鹏,薛松柏,等.焊接学报,2013,34(6),57.35 Xue P, Liang W L, Wang K H, et al. Transactions of the China Welding Institution,2017,38(12),29(in Chinese).薛鹏,梁伟良,王克鸿,等.焊接学报,2017,38(12),29.36 Xue P, Zhou Q, Wang K H, et al. Transactions of the China Welding Institution,2016,37(3),33(in Chinese).薛鹏,周琦,王克鸿,等.焊接学报,2016,37(3),33.37 Zhang L, Han J G, Guo Y H, et al. Journal of Mechanical Engineering,2012,48(24),55(in Chinese).张亮,韩继光,郭永环,等.机械工程学报,2012,48(24),55.38 Ye H, Xue S B, Xue P, et al. Transactions of the China Welding Institution,2012,33(4),42(in Chinese).叶焕,薛松柏,薛鹏,等.焊接学报,2012,33(4),42.39 Xue P, Xue S B, Shen Y F, et al. Transactions of the China Welding Institution,2011,32(8),53(in Chinese).薛鹏,薛松柏,沈以赴,等.焊接学报,2011,32(8),53.40 Schmitt-Thomas K G, Schmidt C. Soldering & Surface Mount Technology,1994,6(3),4.41 Li C F, Liu Z Q. Acta Materialia,2013,61(2),589.42 Wang W K, Zhao M Q, Wu T. Electronic Process Technology,2006,27(1),12(in Chinese).王伟科,赵麦群,邬涛.电子工艺技术,2006,27(1),12.43 Wang S P, Li X, Wang X K. Guangdong Chemical Industry,2016,43(4),36(in Chinese).王石平,李新,王向科.广东化工,2016,43(4),36.44 Zhu H Q. Materials Research and Application,2016,10(1),61(in Chinese).朱火清.材料研究与应用,2016,10(1),61.45 Chen K, Wilcox G D. Physical Review Letters,2005,94(6),066104.46 Liu Y, Ding Y H, Mao Z G, et al. Plating & Finishing,2017,39(6),12(in Chinese).刘月,丁运虎,毛祖国,等.电镀与精饰,2017,39(6),12.47 Jin X, Mao A Q, Gu X L. Electronic Process Technology,2007,28(6),334(in Chinese).金霞,冒爱琴,顾小龙.电子工艺技术,2007,28(6),334.48 Sun F L, Zhang Y H, Cai Z H, et al. Material Research and Application,2011,5(1),49(in Chinese).孙福林,张宇航,蔡志红,等.材料研究与应用,2011,5(1),49.49 Shi S Q, Dong Z G, Qian Y Y. Electronic Process Technology,2000,21(6),231(in Chinese).石素琴,董占贵,钱乙余.电子工艺技术,2000,21(6),231.50 Gao S. Printed Circuit Information,2009(9),59(in Chinese).高四.印制电路信息,2009(9),59.51 Businger J A, Wyngaard J C, Izumi Y, et al. Journal of Atmospheric Sciences,1971,28(28),181.52 Garavello M, Natalini R, Piccoli B, et al. Networks & Heterogeneous Media,2017,2(1),159.53 Tong Y T, Ng H S, Zhong Z. Microelectronics Reliability,2006,46(12),2131.54 Xu D X, Tian J F, Wang D B, et al. Hot Working Technology,2014,43(11),38(in Chinese).徐冬霞,田金峰,王东斌,等. 热加工工艺,2014,43(11),38.55 Zhou Y X, Lei Y P, Xia Z D, et al. Electronic Components and Mate-rials,2009,28(9),69(in Chinese).周永馨,雷永平,夏志东,等.电子元件与材料,2009,28(9),69.56 Yang Y J, Zhao M Q, Wu D Z, et al. Electronic Process Technology,2014,35(3),125(in Chinese).杨雅婧,赵麦群,吴道子,等.电子工艺技术,2014,35(3),125.57 Zhong J C, Hao Z F, Wu Q Q, et al. Plating & Finishing,2013,32(1),37(in Chinese).钟金春,郝志峰,吴青青,等.电镀与涂饰,2013,32(1),37.58 Zheng J C, Yang X J, Lei Y P, et al. Electric Welding Machine,2011,41(7),79(in Chinese).郑家春,杨晓军,雷永平,等.电焊机,2011,41(7),79.59 Ferrari M, Ravera F. Advances in Colloid and Interface Science,2010,161(1),22.60 Zhang W L, Li S Y. Total Corrosion Control,2005,19(6),42(in Chinese).张卫丽,李淑英.全面腐蚀控制,2005,19(6),42.61 Zeng G, Xue S, Zhang L, et al. Journal of Materials Science: Materials in Electronics,2010,21(5),421.62 Zou H F, Zhang Q K, Zhang Z F. Materials Science & Engineering A,2012,532(1),167.63 Xu T, Hu X W, Jiang X X. Electronic Components and Materials,2016,35(2),65(in Chinese).徐涛,胡小武,江雄心.电子元件与材料,2016,35(2),65.64 Zhang R Z, Zhao R, Guo F. Chinese Journal of Materials Research,2010,24(2),137(in Chinese).张睿竑,赵然,郭福.材料研究学报,2010,24(2),137.65 Zhao Y P, Huo F. Nonferrous Metal Materials and Engineering,2015,36(2),65(in Chinese).赵玉萍,霍飞.有色金属材料与工程,2015,36(2),65.66 Yu X, Li Y L, Hu X W, et al. Transactions of the China Welding Institution,2015,36(10),29(in Chinese).余啸,李玉龙,胡小武,等.焊接学报,2015,36(10),29.67 Feng Z G, Yu D W, Zhu Y H. Electronic Process Technology,2004,25(6),243(in Chinese).冯志刚,郁鼎文,朱云鹤.电子工艺技术,2004,25(6),243.68 Wang L L, Sun F L, Wang L F, et al. Electronic Components and Mate-rials,2009,28(7),73(in Chinese).王玲玲,孙凤莲,王丽凤,等.电子元件与材料,2009,28(7),73.69 Quan Y H, Sun F L, Wang L F, et al. Electronic Components and Mate-rials,2009,28(7),73(in Chinese).权延慧,孙凤莲,王丽凤,等.电子元件与材料,2009,28(9),73.70 Hao J J, Gu J, Zhao P, et al. Electronic Components and Materials,2017,36(3),63(in Chinese).郝娟娟,顾建,赵鹏,等.电子元件与材料,2017,36(3),63.71 Zhou Y T, Ding D Y, Mao D L. Materials Review,2012,26(S1),39(in Chinese).周艳婷,丁冬雁,毛大立.材料导报,2012,26(专辑19),39.72 Yao L H. Research on semiconductor laser soldering technology. Master’s Thesis, Nanjing University of Aeronautics and Astronautics, China,2006(in Chinese).姚立华.半导体激光软钎焊技术研究.硕士学位论文,南京航空航天大学,2006.73 Zhu Y X, Chang S. Electronic Process Technology,2018,39(1),20(in Chinese).朱永鑫,常烁.电子工艺技术,2018,39(1),20.74 Shi J W, He P, Qian Y Y, et al. Electronic Process Technology,2004,25(3),102(in Chinese).史建卫,何鹏,钱乙余,等.电子工艺技术,2004,25(3),102.75 Peng Y, Wang W G, Liu X. Hot Working Technology,2011,40(1),149(in Chinese).彭勇,王万刚,刘新.热加工工艺,2011,40(1),149.76 Shi J W, Song Y Z. Electronic Process Technology,2011,32(1),58(in Chinese).史建卫,宋耀宗.电子工艺技术,2011,32(1),58.77 Qu J. Practical Electronics,2005(12),50(in Chinese).曲静.电子制作,2005(12),50.78 Xie H P, Yu D Q, Ma H T, et al. The Chinese Journal of Nonferrous Metals,2004,14(10),1694(in Chinese).谢海平,于大全,马海涛,等.中国有色金属学报,2004,14(10),1694.79 Chen Y M, Wang Z H, Ma J S, et al. Electronic Components and Mate-rials,2018,37(7),8(in Chinese).陈一鸣,王正宏,马莒生,等.电子元件与材料,2018,37(7),8.80 Wang W G, Wang X P, Peng Y. Manufacturing Automation,2010,32(1),48(in Chinese).王万刚,王小平,彭勇.制造业自动化,2010,32(1),48.81 Zhao S. Study on the influence of wave soldering on BGA solder joints in mixed process. Master’s Thesis, Beihua Institute of Aerospace Enginee-ring, China,2017(in Chinese).赵帅.混装工艺中波峰焊对BGA焊点影响的研究.硕士学位论文,北华航天工业学院,2017.82 Gao L, Xue S, Zhang L, et al. Microelectronic Engineering,2010,87(11),2025.83 Wang L, Liu X J, Wang Q, et al. Electronic Components and Materials,2014,33(5),75(in Chinese).王玲,刘晓剑,王强,等.电子元件与材料,2014,33(5),75.84 Chen L Y. Electronic Process Technology,2014,35(1),45(in Chinese).陈丽燕.电子工艺技术,2014,35(1),45.85 Yang L, Yang H. Glass,2010,11(6),3693.86 Wang Y P, Yang J. Electronics and Packaging,2011,11(5),1(in Chinese).王玉鹏,杨洁.电子与封装,2011,11(5),1.87 Han B, Tan Z D, Zhou X, et al. Equipment for Electronic Product Manufacturing,2014,227(1),1(in Chinese).韩彬,檀正东,周旋,等.电子工业专用设备,2014,227(1),1.88 Han Z J, Xue S B, Wang J X, et al. Electric Welding Machine,2008,38(9),27(in Chinese).韩宗杰,薛松柏,王俭辛,等.电焊机,2008,38(9),27.89 Zhang X, Xue S B, Han Z J, et al. Transactions of the China Welding Institution,2008,29(2),22(in Chinese).张昕,薛松柏,韩宗杰,等.焊接学报,2008,29(2),22.90 Wang C Q, Jiang Y H, Qian Y Y. In: National Electronics Industry Welding Conference.1992(in Chinese).王春青,姜以宏,钱乙余.全国电子工业焊接学术会议.1992.91 Tian Y H, Wang C Q. Acta Metallurgica Sinica,2002,38(1),95(in Chinese).田艳红,王春青.金属学报,2002,38(1),95.92 Yao L H, Xue S B, Liu L. Welding & Joining,2005(8),40(in Chinese).姚立华,薛松柏,刘琳.焊接,2005(8),40.93 Yang W, Messler R W, Felton L E. Journal of Electronic Materials,1994,23(8),765.94 Cui H P, Cheng E Q. Transactions of the China Welding Society,2015,36(11),21(in Chinese).崔海坡,程恩清.焊接学报,2015,36(11),21.95 Beckett P M, Fleming A R, Gilbert J M, et al. Soldering & Surface Mount Technology,2002,14(1),24.96 Tian Y H, Wang C Q. Electronic Process Technology,2002,23(4),139(in Chinese).田艳红,王春青.电子工艺技术,2002,23(4),139.