INORGANIC MATERIALS AND CERAMIC MATRIX COMPOSITES |
|
|
|
|
|
An Improved Copper Etching Method that Involves PMMA/PVA Dual Support Membranes and Serves to Transfer Graphene |
WANG Shengtao1,2, LU Weier1,3, WANG Tong1, XIA Yang1,4
|
1 Microelectronic Instrument and Equipment Research Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029 2 College of Science, Beijing Jiaotong University, Beijing 100044 3 Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029 4 University of Chinese Academy of Sciences, Beijing 101407 |
|
|
Abstract Graphene has been regarded as a promising material with wide applications in microelectronic devices, biosensors, fuel cells and energy sto-rage devices owing to its unique properties, such as high carrier mobility, high thermal conductivity and high mechanical strength. How to transfer graphene onto relevant substrates while minimising resin residues and cracks deserves is a crucial point for fabricating electronic devices using graphene. The conventional graphene transfer technology based on copper etching method has been plagued by the defect of surface pollution resulting from the unresolved and remained PMMA. We herein proposed an improved copper etching method, i.e. PMMA/PVA dual support membranes method, by indroducing a layer of polyvinyl alcohol (PVA,98% alcoholysis) with high water solubility to serve as the barrier layer between PMMA (providing high strength) and graphene. According to the results of optical microscopy (OM), Raman spectroscopy and electrical properties measurement, the transferred graphene with less residual, clean surface, high crystallinity and satisfactory back gate field effect transistor (BGFET) carrier mobility can be obtained through this improved copper etching method. Moreover, this method also has the advantages of both simple operation and potential universality for the transfer of other two-dimensional materials.
|
Published: 31 January 2019
|
|
Fund:This work was financially supported by National Science Foundation of China (61604175,61427901). |
About author:: Shengtao Wang received his M.S. degrees in June 2018 from Beijing Jiaotong University in engineering. From March 2017 to March 2018, he co-educated and lear-ned at the Institute of Microelectronics (CAS), focusing on the research of two-dimensional materials and optical components.Weier Lu received her PhD. Degree in materials from Institute of Physics and Chemistry (CAS) in 2012. She is currently an associate professor in Institute of Microelectrics (CAS) and participates in the development of film deposition equipment and technology. Her research interests are preparation of nanofilms, two-dimensional materials and devices. |
|
|
1 Novoselov K S, Geim A K, Morozov S V, et al. Science,2004,306(5696),666. 2 Castro Neto A H. Physics World,2006,19(11),33. 3 Zhang Y, Tan Y W, Stormer H L, et al. Nature,2005,438(7065),201. 4 Balandin A A, Ghosh S, Bao W, et al. Nano Letters,2008,8(3),902. 5 Novoselov K S, Fal V I, Colombo L, et al. Nature,2012,490(7419),192. 6 Ren W, Cheng H M. Nature Nanotechnology,2014,9(10),726. 7 Du Y, Ji T Z, Zhang J Q, et al. Journal of Aeronautical Materials,2013,33(1),68(in Chinese). 杜彦,季铁正,张教强,等.航空材料学报,2013,33(1),68. 8 He D, Shen L, Zhang X, et al. AICHE Journal,2014,60(8),2757. 9 Yi P, Zhang H, Shi D, et al. Advanced Materials,2010,21(27),2777. 10 Zou Z Y, Dai B Y, Liu Z F. Science China: Chemistry,2013(1),1(in Chinese). 邹志宇,戴博雅,刘忠范.中国科学:化学,2013(1),1. 11 Chen M, Yan Y, Zhang X F, et al. Journal of Aeronautical Materials,2015,35(2),1(in Chinese). 陈牧,颜悦,张晓锋,等.航空材料学报,2015,35(2),1. 12 Zhang Z Y, Men C L, Cao J, et al. Materials Review A: Review Papers,2017,31(5),130(in Chinese). 张自元,门传玲,曹军,等.材料导报:综述篇,2017,31(5),130. 13 Lin Y C, Lu C C, Yeh C H, et al. Nano Letters,2012,12(1),414. 14 Suk J W, Lee W H, Lee J, et al. Nano Letters,2013,13(4),1462. 15 Her M, Beams R, Novotny L. Physics Letters A,2013,377(21-22),1455. 16 Yang X, Peng H, Xie Q, et al. Journal of Electroanalytical Chemistry,2013,688(4),243. 17 Ngoc H V, Qian Y T, Han S K, et al. Scientific Reports,2016,6,33096. 18 Wu J X, Xu H, Zhang J. Acta Chimica Scinica,2014,72(3),301(in Chinese). 吴娟霞,徐华,张锦.化学学报,2014,72(3),301. 19 Zhang Q H, Han J H, Feng G Y, et al. Acta Physica Sinica, 2012,61(21),000260(in Chinese). 张秋慧,韩敬华,冯国英,等.物理学报,2012,61(21),000260. 20 Thomsen C, Reich S. Physical Review Letters,2000,85,5214. 21 Tao L, et al. The Journal of Physical Chemistry C,2012,116,24068. 22 Wei D, et al. Nano Letters,2009,9,1752. 23 Lin Y M, Jenkins K A, Valdes-Garcia A, et al. Nano Letters,2008,9(1),422. 24 Kim S, Nah J, Jo I, et al. Applied Physics Letters,2009,94(6),062107. 25 Lee H B, Bae C W, Duy L T, et al. Advanced Materials,2016,28,3152. |
|
|
|