| METALS AND METAL MATRIX COMPOSITES |
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| Research Progress of Micro-Alloying Sn-Cu Based Lead-Free Solders |
| FAN Jianglei1, 2, LIU Zhanyun1, LI Yuwen1, WU Shen1, WANG Xiao3, LIU Jianxiu1
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1 Institute of Mechanical and Electrical Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002;
2 Henan Key Laboratory of Mechanical Equipment Intelligent Manufacturing, Zhengzhou University of Light Industry, Zhengzhou 450002;
3 School of Energy and Power Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002 |
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Abstract The environmental protection need of electronic products has promoted the development of lead-free solder alloys in the field of electronic assembly. At present, Sn-Cu based solder is one of the most promising lead-free solders with excellent performa-nces and lower cost. However, the higher melting point, poorer spreading and soldering properties of Sn-Cu based solder on Cu substrate compared with the Sn-Pb solder limit its extensive application. The microstructure and welding performance of Sn-Cu alloy can be improved by adding various alloying elements. Therefore, in this paper, the effects of micro-alloying on the microstructure, wettability and mechanical properties of Sn-Cu based lead-free solders are systematically reviewed. Then,the problems of the alloying for Sn-Cu based solder are pointed out. The development direction and foreground of Sn-Cu based lead-free solders are also discussed.
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Published: 21 November 2018
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2018, Vol. 32 
