废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用

doi:10.11896/j.issn.1005-023X.2018.02.024

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Abstract

To strengthen the interfacial interaction between waste printed circuit boards powders (WPCBP) and polymer matrix, WPCBP was immobilized a layer of SiO₂ nanoparticles to form a novel WPCBP-SiO₂ hybrid filler by sol-gel method. SEM, TGA and FTIR suggested that SiO₂ nanoparticles were chemically bonded onto the surface of WPCBP. Then WPCBP-SiO₂ hybrid filler was modified with a silane coupling agent and incorporated in unsaturated polyester resin (UPE) matrix. The effect of WPCBP-SiO₂ hybrid filler on mechanical properties, interfacial bonding and thermal stability of UPE composites were comprehensively explored. It has been confirmed that WPCBP-SiO₂ hybrid filler could form a strong interfacial interaction with polymer matrix, and markedly enhance the mechanical properties and thermal stability of UPE composites. Besides, the modification of hybrid filler give further improvements of UPE composites.

Key words： hybrid filler WPCBP unsaturated polyester resin mechanical property reinforcing mechanism thermal stability

Published: 25 January 2018

CLC number:

TQ327

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	Articles by authors
	Dechao HU
	Zhixin JIA
	Bangchao ZHONG
	Huanhuan DONG
	Yong DING
	Yuanfang LUO
	Demin JIA

Cite this article:

Dechao HU,Zhixin JIA,Bangchao ZHONG, et al. Preparation of WPCBP/SiO₂ Hybrid Filler and Its Application in Unsaturated Polyester Resin[J]. Materials Reports, 2018, 32(2): 278-281.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.02.024 OR http://www.mater-rep.com/EN/Y2018/V32/I2/278

Schematic diagram of preparation of WPCBP-SiO₂hybrid filler

SEM images of (a—c) WPCBP and (d—f) WPCBP-SiO₂ hybrid filler

FTIR curves of WPCBP, WPCBP-SiO₂ and m-WPCBP-SiO₂

TGA and DTG curves of WPCBP and WPCBP-SiO₂

SEM images of UPE composites filled with (a,b) WPCBP, (c,d) WPCBP-SiO₂ and (e,f) m-WPCBP-SiO₂

Mechanical properties of UPE and UPE composites

Proposed model for the reinforcing mechanismof UPE composites

TGA curves of UPE and UPE composites

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