Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics

doi:10.11896/j.issn.1005-023X.2020.14.h01

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	ZHANG Shuye

Abstract: (a) APL ACFs fabrication process; (b) APL nanofibers cooperated with solders; (c) flex-on-flex interconnection using solder ACFs under bending test; (d) solder ACFs for flexible ultrasonic transducers; (e) ACFs used artificial skin electronics Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates^[1]. Before that, flex-on-board (FOB) assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics, such as smart watches^[2]. FOB is an alternative interconnection for the conventio-nal socket-type interconnection^[3], by achieving a thinner package size, a higher electrical property, a fine-pitch capability and a higher long-term reliability^[4]. Recently, for a higher reliability^[5], solder particles have been applied in anisotropic conductive films (ACFs) to form micron-sized Sn joints. Compared with the polymer ball joints, 3 main advantages were introduced, such as lower resistance, higher reliability and higher power handling capability^[6-8]. Therefore, the ACFs resin properties, silica filler contents, ultrasonic bonding & thermal compression bonding parameters have been developed and optimized for an entirely complete solder ACFs joint and a highly reliable FOB assembly.

出版日期: 2020-07-25 发布日期: 2020-07-14

引用本文:

ZHANG Shuye. Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics[J]. 材料导报, 2020, 34(14): 14001-14002.
ZHANG Shuye. Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics. Materials Reports, 2020, 34(14): 14001-14002.

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http://www.mater-rep.com/CN/10.11896/j.issn.1005-023X.2020.14.h01 或 http://www.mater-rep.com/CN/Y2020/V34/I14/14001

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